Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Stephan Braye"'
Autor:
Pingping Ye, Adam Letize, Jianwen Han, Stephan Braye, Ashley Kuppersmith, Kyle Whitten, Thomas Richardson, Elie Najjar
Publikováno v:
IMAPSource Proceedings. 2022
The requirements for wafer-level packaging (WLP) are becoming more and more stringent both from a sustainability perspective and process performance. For instance, there is a demand for continuous process improvement for within die uniformity (WID) a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3a44415bdcb6d2fd8263b4f636d217c
https://doi.org/10.4071/001c.74736
https://doi.org/10.4071/001c.74736
Autor:
Kyle Whitten, Rich Hurtubise, Jianwen Han, Stephan Braye, Pingping Ye, Thomas Richardson, Elie Najjar
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
We developed a direct current, electrochemical plating process to control the formation of nano-twinned copper (nt-Cu) to fulfill the keen market interest for copper-to-copper direct bonding, or hybrid-bonding, for wafer-level packaging applications.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c3ce215301dc3f7b717a0bf276509b6
https://doi.org/10.23919/iwlpc52010.2020.9375876
https://doi.org/10.23919/iwlpc52010.2020.9375876
Autor:
Kyle Whitten, David Shaffer, Stephan Braye, Jianwen Han, Thomas Richardson, Elie Najjar, Pingping Ye
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Newly developed electrochemical plating baths with the capability of plating features with a wide range of dimensions and ARs will be discussed in this paper. The bath consists of conventional copper sulfate electrolyte and the typical organic additi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28abeb858d910284540e6be65cc00a2d
https://doi.org/10.1109/ectc32862.2020.00066
https://doi.org/10.1109/ectc32862.2020.00066