Zobrazeno 1 - 10
of 148
pro vyhledávání: '"Steffen Wiese"'
Autor:
Erik Wiss, Steffen Wiese
Publikováno v:
Metals, Vol 14, Iss 9, p 986 (2024)
A rework of electronic assemblies and the reuse of electronic components are the most effective ways to reduce electronic waste. Since neither components nor substrates were developed with the intention of multiple usage, the question of how the inte
Externí odkaz:
https://doaj.org/article/29ccc4898c35408fa0f545171dd74621
Publikováno v:
Materials, Vol 17, Iss 11, p 2702 (2024)
Multilayer ceramic capacitors (MLCCs) are critical components when thermal processes such as reflow desoldering are used during rework of electronic assemblies. The capacitor’s ferroelectric BaTiO3 body is very brittle. Therefore, thermomechanical
Externí odkaz:
https://doaj.org/article/b74dda91159a47e1a470f303442f6970
The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes
Publikováno v:
Applied Sciences, Vol 12, Iss 5, p 2397 (2022)
In order to introduce new bonding methods in the area of electronic packaging a theoretical analysis was conducted, which should give substantial information about the potential of reactive multilayer systems (rms) to create sufficient local heat for
Externí odkaz:
https://doaj.org/article/a751281e1d6d4661b3c8d206059a3c2e
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a84fd706581ab906177a8db1b25bfa7f
https://doi.org/10.1109/eurosime56861.2023.10100772
https://doi.org/10.1109/eurosime56861.2023.10100772
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::307789e4ef9ccb704660b44e38bec700
https://doi.org/10.1109/eurosime56861.2023.10100847
https://doi.org/10.1109/eurosime56861.2023.10100847
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b49948b5f47a1a07a2dbbd49427f7e98
https://doi.org/10.1109/eurosime54907.2022.9758920
https://doi.org/10.1109/eurosime54907.2022.9758920
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:18-29
This article focuses on the morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in small Sn–Ag–Cu (O $270~\mu \text{m}$ ) solder balls. The Cu6Sn5 phase showed a large variety of different shapes and sizes, ranging from facetted hexagonal rod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5076150a991325095a09a3687c9ca06e
https://doi.org/10.1109/tcpmt.2019.2952093
https://doi.org/10.1109/tcpmt.2019.2952093
Publikováno v:
Microelectronics Reliability. 139:114751
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a211b05dee2596a8d064a39dd9c2c426
https://doi.org/10.1016/j.microrel.2022.114751
https://doi.org/10.1016/j.microrel.2022.114751
Autor:
Achim Kraft, A.J. Beinert, Pascal Romer, Ulrich Eitner, Johann Walter, Steffen Wiese, Li Carlos Rendler, Sandor Stecklum
Publikováno v:
Solar Energy Materials and Solar Cells. 196:167-177
This study analyses thermomechanical stresses in silicon solar cells after the soldering process by finite element modeling. An experimentally validated model shows compressive and tensile stresses, longitudinal and transversal to a busbar or a pad r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74794c72a48cc895a8fc902ad1b6e893
https://doi.org/10.1016/j.solmat.2019.03.041
https://doi.org/10.1016/j.solmat.2019.03.041
Publikováno v:
Thermochimica Acta. 714:179245
This study introduces the application of infrared (IR) thermography for the determination of melting and solidification temperatures of Sn-Ag-Cu based solder materials commonly used for interconnects in electronic components and devices. The presente
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5550cd26d8bef4121885303a5c216f84
https://doi.org/10.1016/j.tca.2022.179245
https://doi.org/10.1016/j.tca.2022.179245