Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Steffen Kieß"'
Autor:
Peter Gänz, Guangpu Yang, Charles Clark, Steffen Kieß, Tanja Pienkny, Andreas Balles, Astrid Hölzing, Paul Tafforeau, Sven Simon
Publikováno v:
e-Journal of Nondestructive Testing, Vol 29, Iss 3 (2024)
Externí odkaz:
https://doaj.org/article/48d8eb22e894403c8a68d4610164f17a
Autor:
Xingyu Liu, Charles Clark, Steffen Kieß, Ammar Alsaffar, Hieu Tran, Guhathakurta Jajnabalkya, Sven Simon
Publikováno v:
e-Journal of Nondestructive Testing, Vol 29, Iss 3 (2024)
Externí odkaz:
https://doaj.org/article/82d07ccba2054131886a3b4ac03ff7a6
Publikováno v:
Journal of Real-Time Image Processing. 19:1063-1079
In computed tomography (CT), scattering causes server quality degradation of the reconstructed CT images by introducing streaks and cupping artifacts which reduce the detectability of low contrast objects. Monte Carlo (MC) simulation is considered th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f83d5a94fb9329eb0a73d686d0e62e05
https://doi.org/10.1007/s11554-022-01247-7
https://doi.org/10.1007/s11554-022-01247-7
Autor:
Jose Manuel Marinos Velarde, Steffen Kieß, Sven Simon, Jajnabalkya Guhathakurta, Zhe Wang, Seyyed Mahdi Najmabadi, Yousef Baroud
Publikováno v:
Journal of Real-Time Image Processing. 16:2127-2146
Due to throughput requirements above 1 gigapixel/sec for the real-time compression of modern image and video data streams, parallelism for encoding and decoding is inevitable. To achieve parallel decoding, a well-established technique is to insert ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::446a61531046db5b532bbb2f10bd32f0
https://doi.org/10.1007/s11554-017-0715-2
https://doi.org/10.1007/s11554-017-0715-2
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 57:847-857
Signal integrity (SI) analysis based on state-of-the-art measurements can be difficult to perform especially when the structures of interest are on inner layers of multilayer boards or are enclosed by IC packages. To enable an SI analysis in such cas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e2cfb917b88724da9cf0aba02898883
https://doi.org/10.1109/temc.2015.2435995
https://doi.org/10.1109/temc.2015.2435995
Publikováno v:
Physics in medicine and biology. 61(7)
Single cell nuclei were investigated using two-dimensional angularly and spectrally resolved scattering microscopy. We show that even for a qualitative comparison of experimental and theoretical data, the standard Mie model of a homogeneous sphere pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9d54d63b355f35fdc490597a92789cf6
https://pubmed.ncbi.nlm.nih.gov/26976736
https://pubmed.ncbi.nlm.nih.gov/26976736
Publikováno v:
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8fc407541682507a91e3d0d9596edb4d
https://doi.org/10.1109/isemc.2014.6899109
https://doi.org/10.1109/isemc.2014.6899109
Publikováno v:
2012 IEEE 16th Workshop on Signal and Power Integrity (SPI).
In this paper a method is proposed for extracting S-parameters of bond wires using computed tomography (CT) analysis techniques and 3D EM field simulations. The method is based on the generation of bond wire CAD models from CT image data. Such models
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c86ad0a60349d0377f79a84402f2148
https://doi.org/10.1109/sapiw.2012.6222907
https://doi.org/10.1109/sapiw.2012.6222907
Publikováno v:
78th ARFTG Microwave Measurement Conference.
This paper presents a method for S-parameter extraction of passive sub-circuits embedded in complex microwave circuits. We employed computed tomography (CT) scans and measured substrate material parameters. The principle is based on the automatic rec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fcb98d41cc534db81e40ac90930b7a52
https://doi.org/10.1109/arftg78.2011.6183869
https://doi.org/10.1109/arftg78.2011.6183869
Publikováno v:
2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.
In this paper three different methods for reconstructing CAD models of solder balls based on 3D computed tomography (CT) data are discussed. The resulting CAD model contains accurate geometrical data of the device which can be used for an electromagn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e9c79ea73c156c819a192253907ca71
https://doi.org/10.1109/epeps.2011.6100246
https://doi.org/10.1109/epeps.2011.6100246