Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Stefano Sardo"'
Publikováno v:
ECS Transactions. 102:117-123
CMOS optical sensors devices are becoming increasingly important and popular for many different applications. Some of these devices are fabricated starting from SOI wafers and using semiconductor manufacturing techniques. A common feature of the CMOS
Autor:
Gerald Beyer, Joeri De Vos, Lan Peng, Anne Jourdain, Daniele Piumi, Eric Beyne, Nina Tutunjyan, Andy Miller, Nouredine Rassoul, Stefaan Van Huylenbroeck, Fumihiro Inoue, Stefano Sardo
Publikováno v:
Microelectronic Engineering. 196:38-48
Since the challenges of maintaining the Moore's law - through traditional dimensional scaling or exploiting new materials properties - are becoming increasingly difficult, 3D integration technologies are gaining more and more attention and importance
Autor:
Andy Miller, Nina Tutunjyan, Janet Hopkins, Nouredine Rassoul, Joeri De Vos, Fumihiro Inoue, Oliver Ansel, Eric Beyne, Daniele Piumi, Huma Ashraf, Gerald Beyer, Dave Thomas, Jash Patel, Stefano Sardo, Anne Jourdain, Edward Walsby
Publikováno v:
Microelectronic Engineering. 192:30-37
Over the past few years, extreme wafer thinning has acquired more interest due to its importance in 3D stacked system architecture. This technique facilitates multi-wafer stacking for via last advanced packaging. From a cost and wafer integrity point
Autor:
Nina Tutunjyan, Eric Beyne, Joeri De Vos, Andy Miller, Anne Jourdain, Nancy Heylen, Stefaan Van Huylenbroeck, Geraldine Jamieson, Lan Peng, Stefano Sardo
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
This paper presents face-to-face wafer-to-wafer (W2W) bonding using SiCN-to-SiCN dielectric bonding, in combination a novel 1µm diameter via last connection between top and bottom wafers, called "hole-in-one TSV". This scheme reduces besides the int
Autor:
Stefano Sardo, Nina Tutunjyan, Yunlong Li, Michele Stucchi, Stefaan Van Huylenbroeck, Eric Beyne, Filip Beirnaert, Gerald Beyer, N. Jourdan, John Slabbekoorn, L. Bogaerts
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Current TSV integration schemes include via-first, via-middle and via-last process flows. In this paper, a low thermal budget, 10im pitch and aspect ratio 10 (5im diameter, 50im depth) via-last TSV module is presented. The proposed via-last module is
Autor:
Sergio Doneda, Romano Morson, Maria Chiara Ubaldi, Anna Donghi, Alessandro Nottola, Umberto Colombo, Stefano Sardo, G. Mutinati, Melissa Di Muri, F. Giacometti, Massimo Gentili
Publikováno v:
Microelectronic Engineering. 85:1210-1213
In this paper a strategy for the reduction of the line edge roughness (LER) of silicon-on-insulator (SOI) waveguides is presented. SOI technology is particularly attractive for next generation integrated optical components thanks to the very high ind
Autor:
Davide Diego Crippa, P. Crespi, Alessandro Nottola, Stefano Sardo, G. Zuliani, S. Ghidini, M. Tormen, F. Giacometti, D. Chacon, Melissa Di Muri
Publikováno v:
Journal of Lightwave Technology. 24:1896-1902
In the context of optical filters for wavelength division multiplexing systems, the randomly sampled apodization is introduced to apodize the spectral response of a Bragg grating (BG). By conveniently sampling the refractive-index modulation along th
Autor:
Umberto Colombo, Alessandro Nottola, Giorgio Zuliani, Stefano Sardo, Sergio Doneda, Audrey Garnier, Melissa Di Muri, Massimo Gentili, Antonio Fiorino, Marco Romagnoli, Romano Morson, F. Giacometti, Davide Diego Crippa
Publikováno v:
Microelectronic Engineering. 85:1511-1513
In this paper a novel process for fabrication of high finesse and large spectral range integrated optics filtering structure for optical communication applications is presented. The technology approach used in the fabrication make use of glass-on-sil
Autor:
D. Chacon, Lorenzo Bolla, Sergio Doneda, Marco Romagnoli, Raffaele Corsini, Romano Morson, C. Rampinini, F. Giacometti, G. Mutinati, T. Tomasi, Giorgio Grasso, A. Cabas, Alessandro Nottola, Massimo Gentili, Silvia Ghidini, M. Di Muri, S. Marinoni, Paola Galli, Luciano Socci, G. Zuliani, Stefano Sardo, Stefano Lorenzotti
Silicon is the dominant material in the microelectronic industry and silicon photonics is rapidly gaining importance as a technological platform for a wide range of applications in telecom, and optical interconnect. It allows the implementation of ma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d650a358c4605af83831d607eebb0ef8
http://hdl.handle.net/11382/342587
http://hdl.handle.net/11382/342587
Autor:
G. Mutinati, S. Lorenzotti, G. Zuliani, T. Tomasi, Sergio Doneda, S. Ghidini, A. Cabas, Alessandro Nottola, M. Di Muri, Massimo Gentili, Marco Romagnoli, Paola Galli, F. Giacometti, Luciano Socci, Giorgio Grasso, Stefano Sardo
Publikováno v:
2007 9th International Conference on Transparent Optical Networks.
Silicon is increasingly considered as the next future platform for photonic integrated circuits. Low loss Si waveguides and in particular the microring resonator approach seems to be very promising toward the realization of ultra compact, low cost, m