Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Stefan Wöhlert"'
Autor:
Werner Robl, Sven Gustav Lanzerstorfer, Stefan Decker, Markus Ladurner, Thomas Detzel, Stefan Wöhlert, Bernhard Auer, Michael Rogalli, Robert Illing, Michael Nelhiebel, J. Fugger
Publikováno v:
Microelectronics Reliability. 53:1745-1749
Electric overload situations in automotive truck applications necessitate a particularly efficient and reliable heat management for silicon power devices, especially when repetitive events must be handled. We show by simulations and experiments that
Publikováno v:
Microelectronics Reliability. 52:1966-1970
In this study the intermetallic compound (IMC) formation of annealed 50 μm copper wires, thermosonically nailhead bonded to thick Al−0.5 wt.% Cu pads, was investigated. The annealing experimental matrix covered the full range of Al consumption. Th
Autor:
T. Herzig, Christoph Schreiber, Christoph Kadow, Donald Dibra, Michael Nelhiebel, M. Inselsbacher, Michael Glavanovics, Sylvain Fraïssé, Stefan Wöhlert, Robert Illing, Markus Ladurner, Sven Gustav Lanzerstorfer, Stefan Decker, Michael Rogalli, M. Poschgan, Werner Robl, H. Unterwalcher
Publikováno v:
Microelectronics Reliability. 51:1927-1932
We demonstrate that by novel technology concepts, silicon devices can handle electrical power pulses millions of times without failure, although peak temperatures in the silicon reach 350 °C during every cycle. This was made possible by a robust tre
Publikováno v:
MRS Proceedings. 343
The phase selection which is generally observed in the early stages of solid-state reactions was studied using Ti-Al multilayer films as a model system.Although all Ti-Al intermetallic phases have similar driving forces of about 30 kJ/g-atom, TiAl3 i
Conference
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