Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Stefan Saller"'
Publikováno v:
IEEE Journal of Solid-State Circuits. 51:273-280
An ultra-thin ( $20\;\bm{\upmu} {\bf m}$ ), flexible CMOS stress sensor for hybrid systems-in-foil (HySiF) is presented. The system is designed for Fin Ray® grippers in order to measure the emerging stress on the gripper in operation, enabling the e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4e73556422fd6a73d749d4c3e4d6032
https://doi.org/10.1109/jssc.2015.2498183
https://doi.org/10.1109/jssc.2015.2498183
Autor:
Stefan Saller, Jan Kostelnik, Enno Lorenz, Andreas Kugler, Alina Schreivogel, Zili Yu, Joachim N. Burghartz, Christine Harendt
Publikováno v:
Solid-State Electronics. 113:101-108
Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c30ddd03b0f77814c00709c03d14827c
https://doi.org/10.1016/j.sse.2015.05.023
https://doi.org/10.1016/j.sse.2015.05.023
Autor:
Christine Harendt, Jan Kostelnik, Joachim N. Burghartz, Zili Yu, Stefan Saller, Andreas Kugler
Publikováno v:
ESSDERC
Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e142c262c40c8ef86b146a8cda3b4a84
https://doi.org/10.1109/essderc.2014.6948797
https://doi.org/10.1109/essderc.2014.6948797