Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Stefan Kaessner"'
Publikováno v:
Journal of the American Ceramic Society. 102:4376-4387
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8cae662f16f06a20566a3dfbc818b242
https://doi.org/10.1111/jace.16314
https://doi.org/10.1111/jace.16314
Autor:
Stefan Behrendt, Klaus G. Nickel, Markus G. Scheibel, Stefan Kaessner, Bianca Boettge, Christoph Berthold
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 15:132-139
Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f0e991b48596905747e49c09ea9f817
https://doi.org/10.4071/imaps.661015
https://doi.org/10.4071/imaps.661015
Autor:
Felix Wagner, Stefan Kaessner, Bernhard Wunderle, Martin Rittner, Lukas Lang, Michael Guyenot, Youssef Maniar
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The need for small, high efficient (98%) and high temperature capable $(200^{\circ}{\rm{C}})$ power electronics lead to the development of SiC-power modules, which can satisfy these advanced requirements. Power electronics have often to resist harsh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c02ced409119eaf2256dcd47f664fbc7
https://doi.org/10.1109/eurosime.2019.8724587
https://doi.org/10.1109/eurosime.2019.8724587
Autor:
Sandy Klengel, Stefan Kaessner, A. Z. Miric, M. G. Scheibel, G. Hejtmann, R. Eisele, Falk Naumann, Matthias Petzold, S. Behrendt, Klaus G. Nickel, Bianca Boettge
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The paper introduces novel phosphate cement- and calcium aluminate cement-based material systems with enhanced thermal, mechanical and thermomechanical properties for the encapsulation of power electronic devices and modules. These materials are aimi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b05c19baaa25f10ef30efe50f8939f8e
https://doi.org/10.1109/ectc.2018.00194
https://doi.org/10.1109/ectc.2018.00194
Publikováno v:
Microelectronics Reliability. :113430
The demands on power modules regarding power density and reliability are continuously rising. Conventional encapsulation materials are limited in their thermal performance. In this study, a completely new material class is used within a power module.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d7fcfc3e28a73ba8e04366ce093d40e
https://doi.org/10.1016/j.microrel.2019.113430
https://doi.org/10.1016/j.microrel.2019.113430