Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Stefan Defregger"'
Publikováno v:
IEEE Access, Vol 8, Pp 166880-166906 (2020)
A heat sink is a specific type of heat exchanger integrated with heat generating devices - mostly electronics - for the sake of thermal management. In the design procedure of heat sinks, several considerations such as manufacturing cost, reliability,
Externí odkaz:
https://doaj.org/article/f2cccdf19eda447f9d48a37d039f81f9
Publikováno v:
Energies, Vol 14, Iss 22, p 7650 (2021)
As a consequence of rapid development of additive manufacturing (3D printing) methods, the academic/industrial demand has been continuously increasing. One field of application is the manufacturing of heat exchanging devices using this promising meth
Externí odkaz:
https://doaj.org/article/60d885170313443fad04c467a28ecf9d
Autor:
Romana Boiger, Stefan Defregger, Mirza Grbic, Anton Köck, Manfred Mücke, Robert Wimmer-Teubenbacher, Bernat Zaragoza Travieso
Publikováno v:
Proceedings, Vol 2, Iss 13, p 1058 (2019)
Metal oxide (MOx) gas sensor signals are mainly governed by adsorption and desorption processes of oxygen and its reaction with surrounding gas molecules. Different target gases exhibit different reaction rates leading to characteristic sensor respon
Externí odkaz:
https://doaj.org/article/199877e1e6c749f7ab931c4c6a3ac244
Publikováno v:
Energies, Vol 12, Iss 4, p 610 (2019)
A 166-nm-thick amorphous Niobium pentoxide layer (Nb2O5) on a silicon substrate was investigated by using time domain thermoreflectance at ambient temperatures from 25 °C to 500 °C. In the time domain thermoreflectance measurements, thermal transie
Externí odkaz:
https://doaj.org/article/b086c8ca76654c389c9d4fa5b4d8fd2d
Autor:
Robert Wimmer-Teubenbacher, Florentyna Sosada-Ludwikowska, Bernat Zaragoza Travieso, Stefan Defregger, Oeznur Tokmak, Jan Steffen Niehaus, Marco Deluca, Anton Köck
Publikováno v:
Chemosensors, Vol 6, Iss 4, p 56 (2018)
Metal oxides (MOx) are a well-established material for gas sensing. MOx-based gas sensors are sensitive to a wide variety of gases. Furthermore, these materials can be applied for the fabrication of low-cost and -power consumption devices in mass pro
Externí odkaz:
https://doaj.org/article/94d4ba0f1f1149a0b1937e99d7ec0c3b
Publikováno v:
IEEE Access, Vol 8, Pp 166880-166906 (2020)
A heat sink is a specific type of heat exchanger integrated with heat generating devices - mostly electronics - for the sake of thermal management. In the design procedure of heat sinks, several considerations such as manufacturing cost, reliability,
Autor:
K. Fladischer, René Hammer, V. Leitgeb, A. Buerke, Lisa Mitterhuber, Stefan Defregger, F. Peter
Publikováno v:
Journal of Applied Physics
Scanning thermal microscopy (SThM) enables thermal conductivity (λ) measurements with a lateral resolution down to a few tens of nanometers. The present work investigates ways to improve SThM images recorded with resistive probes. Probes based on re
Autor:
Jördis Rosc, Julien Magnien, Lisa Mitterhuber, Stefan Hörth, Franz Schrank, Lena Goullon, Stefan Defregger, Matthias Hutter, René Hammer, Elke Kraker
Publikováno v:
Microelectronics Reliability. 81:373-380
Reliability testing has become a major focus for light emitting diode (LED) systems to predict its lifetime. One common type of testing methods, which was investigated in this study, is the supply switching test (SST), also called power cycle test. I
Publikováno v:
Energies
Volume 14
Issue 22
Energies, Vol 14, Iss 7650, p 7650 (2021)
Volume 14
Issue 22
Energies, Vol 14, Iss 7650, p 7650 (2021)
As a consequence of rapid development of additive manufacturing (3D printing) methods, the academic/industrial demand has been continuously increasing. One field of application is the manufacturing of heat exchanging devices using this promising meth
Autor:
Franz Schrank, Elke Kraker, Matthias Hutter, Stefan Hörth, Julien Magnien, Lisa Mitterhuber, René Hammer, Stefan Defregger
Publikováno v:
Microelectronics Reliability. 79:462-472
Thermal management in the solid-state lighting sector has become a main issue, due to reliability and efficiency issues. Herein, thermal structure function analysis provides a powerful tool to understand the heat transfer inside operated light emitti