Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Steen, J.L.P.J. van der"'
Publikováno v:
FLEPS 2019-IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings, 1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019, 7 July 2019 through 10 July 2019
Thermal imagers conventionally consist of a suspended sensing element on support structure with patterned thermal detection layer to get good thermal isolation between sensor elements[1]. Large area and wearable thermal imaging applications require c
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Autor:
Zulqarnain, M., Stanzione, S., Steen, J.L.P.J. van der, Gelinck, G.H., Myny, K., Abdinia, S., Cantatore, E.
Publikováno v:
44th IEEE European Solid State Circuits Conference, ESSCIRC 2018, 3 September 2018 through 6 September 2018, 126-129
This paper presents a 52 μW heart-rate measurement interface for wearable applications, fabricated on a flexible foil with a-IGZO TFTs. The interface consists of a cascaded diode-connected load preamplifier with a gain of 22 dB in 3 kHz bandwidth. T
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Autor:
Akkermana,H.B., Peeters,B., Breemena, A.J.J.M. van, Shanmugama, S., Tordera Salvador, D.A., Steen, J.L.P.J. van der, Kronemeijer, A.J., Malinowski, P., Roose, F. De, Cheyns, D., Genoeb, J., Dehaene, W., Heremans, P., Gelincka, G.
Publikováno v:
Digest of Technical Papers-SID International Symposium SID Symposium, Seminar, and Exhibition 2018, Display Week 2018. 20 May 2018 through 25 May 2018, 494-497
ispartof: pages:494-497 ispartof: Society for Information Display International Symposium Digest of Technical Papers pages:494-497 ispartof: SID international Symposium location:Los Angeles, CA, USA status: Published online
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Autor:
Garripoli, C., Steen, J.L.P.J. van der, Smits, E., Gelinck, G.H., Roermund, A.H.M. van, Cantatore, E.
Publikováno v:
Fujino, L.C., 64th IEEE International Solid-State Circuits Conference, ISSCC 2017. 5 February 2017 through 9 February 2017, 60, 260-261
Externí odkaz:
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Autor:
Nag, M., Bhoolokam, A., Smout, S., Willegems, M., Muller, R., Myny, K., Schols, S., Ameys, M., Genoe, J., Ke, T.H., Vicca, P., Ellis, T., Cobb, B., Kumar, A., Steen, J.L.P.J. van der, Gelinck, G., Fukui, Y., Obata, K., Groeseneken, G., Heremans, P., Steudel, S.
Publikováno v:
Journal of the Society for Information Display, 10, 22, 509-517
A process to make self-aligned top-gate amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistors (TFTs) on polyimide foil is presented. The source/drain (S/D) region's parasitic resistance reduced during the SiN interlayer deposition step.
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http://resolver.tudelft.nl/uuid:e4c1b80b-0328-432d-ad8f-b860b3be1e0b
http://resolver.tudelft.nl/uuid:e4c1b80b-0328-432d-ad8f-b860b3be1e0b
Autor:
Steen, J.L.P.J. van der, Tripathi, A.K., Maas, J.P.V., Diesen-Tempelaars, K. van, Leuken, L.B. van, Haas,G.J.A.J.F. de, Putten, J.B.P.H. van der, Yakimets, I., Li, F.M.W., Ellis, T.H., Mol,A.M.B. van, Gelinck, G.H., Myny,K., Vicca, P., Smout, S., Ameys, M., Huei Ke, T., Steudel, S., Nag, M., Schols, S., Genoe, J., Heremans, P., Fukui, Y., Green, S.
Publikováno v:
20th International Display Workshops 2013, IDW 2013, 2, 1568-1569
Proceedings of the International Display Workshops, 20, 1568-1596
Proceedings of the International Display Workshops, 20, 1568-1596
We present a low-temperature metal oxide transistor backplane technology using PECVD dielectrics. We show successful integration of the backplane in flexible 200ppi AMOLED displays on ultrathin polymer films. The displays are encapsulated with a thin
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