The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy.

Autor: State Rosoiu SP; Faculty of Medical Engineering, National University for Science and Technology Politehnica Bucharest, 1-7 Gheorghe Polizu Street, 011061 Bucharest, Romania.; National Institute for Research and Development in Microtechnologies-IMT Bucharest, 126A Erou Iancu Nicolae, 077190 Bucharest, Romania.; Center of Surface Science and Nanotechnology, National University for Science and Technology Politehnica Bucharest, Splaiul Independentei 313, 060042 Bucharest, Romania., Costovici S; Center of Surface Science and Nanotechnology, National University for Science and Technology Politehnica Bucharest, Splaiul Independentei 313, 060042 Bucharest, Romania., Enachescu M; Center of Surface Science and Nanotechnology, National University for Science and Technology Politehnica Bucharest, Splaiul Independentei 313, 060042 Bucharest, Romania., Visan T; Center of Surface Science and Nanotechnology, National University for Science and Technology Politehnica Bucharest, Splaiul Independentei 313, 060042 Bucharest, Romania., Anicai L; Center of Surface Science and Nanotechnology, National University for Science and Technology Politehnica Bucharest, Splaiul Independentei 313, 060042 Bucharest, Romania.

Publikováno v: Materials (Basel, Switzerland) [Materials (Basel)] 2024 Feb 23; Vol. 17 (5). Date of Electronic Publication: 2024 Feb 23.