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pro vyhledávání: '"Stéphane Léonard Kuziora"'
Publikováno v:
Journal of Electronic Materials. 52:1284-1294
Solid–liquid interdiffusion is a metallurgical bonding technique, suitable for assembly of temperature sensitive materials. We identify Ag-(In-Bi) as meeting the low-temperature bonding requirements, theoretically as low as 73°C. This work focuses
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91314bef0eca1d193be67b3285040530
https://doi.org/10.1007/s11664-022-10063-5
https://doi.org/10.1007/s11664-022-10063-5
