Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Sriram Anjur"'
Autor:
Chris Rogers, Sriram Anjur, Mansour Moinpour, Chris E. Barns, Caprice Gray, Vincent P. Manno, Ara Philipossian, Daniel Apone
Publikováno v:
Electrochemical and Solid-State Letters. 8:G109-G111
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca2365bdf8a5827bab17dd3e34775960
https://doi.org/10.1149/1.1887193
https://doi.org/10.1149/1.1887193
Autor:
Douglas A. Gauthier, Robert D. White, Sriram Anjur, Mansour Moinpour, Andrew Mueller, Donald Hooper, Chris Rogers, Vincent P. Manno
Publikováno v:
MRS Proceedings. 1085
Micromachined structures with diameters ranging from 50 — 100 μm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP). The structures are 80 μm high p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae66e266dda6723041846709525adef9
https://doi.org/10.1557/proc-1085-t05-11
https://doi.org/10.1557/proc-1085-t05-11
Autor:
Andrew Mueller, Sriram Anjur, Chris Rogers, Robert D. White, Mansour Moinpour, Vincent P. Manno
Publikováno v:
MRS Proceedings. 991
This paper describes the fabrication and calibration of micromachined shear stress sensors intended for characterization of the local pad-wafer contact forces present during chemical-mechanical polishing. Sensors consist of arrays of microfabricated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03618948204ae1b3d96e271c4c0dbd69
https://doi.org/10.1557/proc-0991-c06-03
https://doi.org/10.1557/proc-0991-c06-03
Autor:
Chris Rogers, Caprice Gray, Vincent P. Manno, Mansour Moinpour, Robert D. White, Sriram Anjur
Publikováno v:
MRS Proceedings. 991
It is becoming increasingly clear that understanding the small scale polishing mechanisms operating during CMP requires knowledge of the nature of the pad-wafer contact. Dual Emission Laser Induced Fluorescence (DELIF) can be used to study the fluid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::614c743b68088c1300d9853a59acc414
https://doi.org/10.1557/proc-0991-c01-04
https://doi.org/10.1557/proc-0991-c01-04
Autor:
Caprice Gray, Sriram Anjur, Mansour Moinpour, Chris E. Barns, Vincent P. Manno, Chris Rogers, Ara Philipossian, Daniel Apone
Publikováno v:
MRS Proceedings. 867
Dual Emission Laser Induced Fluorescence (DELIF) is employed to attempt to experimentally determine the nature of the lubrication regime in Chemical Mechanical Planarization. Our DELIF setup provides images of the polishing slurry between the wafer a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::653df0e09a90d5df64e771124872f185
https://doi.org/10.1557/proc-867-w2.3
https://doi.org/10.1557/proc-867-w2.3
Autor:
Caprice Gray, Vincent P. Manno, Sriram Anjur, Ara Philipossian, Mansour Moinpour, Chris E. Barns, Daniel Apone, Chris Rogers
Publikováno v:
World Tribology Congress III, Volume 2.
Modifications to the Dual Emission Laser Induced Fluorescence (DELIF) procedure used to collect images of the slurry layer between the polishing pad and wafer during Chemical Mechanical Planarization (CMP) have provided a means to attain instantaneou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e23a32a47090addfe354d45cd96b6897
https://doi.org/10.1115/wtc2005-63805
https://doi.org/10.1115/wtc2005-63805
Autor:
Vincent P. Manno, Chris Rogers, Sriram Anjur, Mansour Moinpour, Chris E. Barns, Ara Philipossian, Daniel Apone, Caprice Gray
Publikováno v:
MRS Proceedings. 867
The interaction of the wafer, slurry and pad determines the material removal rate during Chemical Mechanical Planarization (CMP). Dual emission laser induced fluorescence (DELIF) provides a means to measure the slurry layer thickness between the wafe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30f97480cd208f42bbc93485cd2ef878
https://doi.org/10.1557/proc-867-w5.4
https://doi.org/10.1557/proc-867-w5.4
Publikováno v:
MRS Proceedings. 867
A dual-sensor single particle optical sensing method (SPOS) is described for the measurement of the large particle count (LPC) in fumed silica polishing slurries. LPC values were expressed on a silica sphere-equivalent diameter scale rather than a po
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::068abc22c2ecc13e759207bf64a4dc93
https://doi.org/10.1557/proc-867-w4.2
https://doi.org/10.1557/proc-867-w4.2
Autor:
Chris Rogers, Moinpour Monsour, Sriram Anjur, Caprice Gray, Chris E. Barns, Daniel Apone, Vincent P. Manno
Publikováno v:
MRS Proceedings. 816
Duel Emission Laser Induced Fluorescence (DELIF) and friction measurements are taken in-situ during CMP to observe slurry flow beneath a model of an integrated circuit (IC) wafer. Friction measurements average around 7.5 lb and multiple frequencies a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b1d5c70550618649b9c5b7031ceaa20
https://doi.org/10.1557/proc-816-k5.4
https://doi.org/10.1557/proc-816-k5.4
Autor:
Len Borucki, Xiaomin Wei, Yasa Sampurno, Ara Philipossian, Yun Zhuang, Ting Sun, Sriram Anjur, Fransisca Sudargho
Publikováno v:
Japanese Journal of Applied Physics. 49:026501
The effect of conditioner aggressiveness is investigated in interlayer dielectric polishing on three types of pad. A method using confocal microscopy is used to analyze the effect of conditioner aggressiveness on pad–wafer contact. Results show tha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8aa20096c4f99b3ebcf31ca66d0de06a
https://doi.org/10.1143/jjap.49.026501
https://doi.org/10.1143/jjap.49.026501