Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Srinivas Vempati"'
Publikováno v:
ECS Transactions. 107:4077-4087
Researchers are interested in developing new nano-composite materials because aluminium metal matrix composites (AMCs) have unique properties. An essential goal of this research is to compare the effects on the AA2014 hybrid nano-composite of varying
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::396557284f6823d434d557a8063f03d8
https://doi.org/10.1149/10701.4077ecst
https://doi.org/10.1149/10701.4077ecst
Autor:
Yoshihiro Tsutsumi, Ho Soon Wee, Venky Sundaram, Lee Wen Sheng Vincent, V. Kripesh, Myo Eipa, Johnson Kek Navas Khan, H S Chua, Srinivas Vempati, L C Yew
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
Wafer thinning has been an important topic in the semiconductor industry. The trend in microelectronic industry is getting thinner and smaller packages. During the process of wafer thinning and sawing, die cracks and thus leading to failures. This pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e478c9a2b01f7a6258f4fcbc8c2227aa
https://doi.org/10.1109/eptc.2009.5416415
https://doi.org/10.1109/eptc.2009.5416415