Zobrazeno 1 - 10
of 44
pro vyhledávání: '"Srikanth Rangarajan"'
Publikováno v:
Engineering, Vol 26, Iss , Pp 185-197 (2023)
The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a
Externí odkaz:
https://doaj.org/article/6a7103d330984b27b40bad3f56127b61
Autor:
Cong Hiep Hoang, Arad Azizi, Najmeh Fallahtafti, Srikanth Rangarajan, Vahideh Radmard, Charles Arvin, Kamal Sikka, Scott Schiffres, Bahgat Sammakia
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1091-1099
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb4fde0ea725838e6f8b240f6cc156e6
https://doi.org/10.1109/tcpmt.2022.3185401
https://doi.org/10.1109/tcpmt.2022.3185401
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1783-1791
Transient numerical studies are performed for the effective medium of phase change material filled with thermal conductivity enhancers for passive thermal management applications during continuous and intermittent operation. Phase change material mel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91eeaa33b46d2343939015432dd33f2c
https://doi.org/10.1109/tcpmt.2021.3108054
https://doi.org/10.1109/tcpmt.2021.3108054
Autor:
Ghazal Mohsenian, Srikanth Rangarajan, Bahgat Sammakia, Scott N. Schiffres, Leila Choobineh, Mohammad I. Tradat, Cong Hiep Hoang, Yaman M. Manaserh, Alfonso Ortega
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1565-1582
In this review, the heat transfer characteristics of several pumped two-phase electronic cooling technologies are quantitatively examined and compared on the basis of heat flux, coolant temperatures, heat source area, base temperature, and coolant ty
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1aad71cb33370171ec33f7fadc58f7b
https://doi.org/10.1109/tcpmt.2021.3117572
https://doi.org/10.1109/tcpmt.2021.3117572
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1724-1733
3-D integration is now considered a new paradigm for the semiconductor packaging industry to sustain Moore’s law. Vertical stacking of semiconductor chips provides high power density in a given footprint area. However, owing to increased integratio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55a95289f761592ced24f00dd5122602
https://doi.org/10.1109/tcpmt.2021.3109662
https://doi.org/10.1109/tcpmt.2021.3109662
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:241-248
This article presents an investigation on transient hot-strip (THS) method for simultaneous estimation of thermal conductivity ( $k$ ) and diffusivity ( $\alpha $ ) based on an inverse parameter estimation technique. Four different heating configurat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e431b4b9ccf7dfd7b640979247b6af2
https://doi.org/10.1109/tcpmt.2020.3032877
https://doi.org/10.1109/tcpmt.2020.3032877
Autor:
Gamal Refai-Ahmed, Suresh Ramalingam, Tahir Cader, Jason Strader, Jari Huttunen, Anthony Torza, Srikanth Rangarajan, Bahgat Sammakia, Vadim Gektin, Hussam Kabbani
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36662a56fad44ee05b20392193a601b9
https://doi.org/10.1109/eptc53413.2021.9663914
https://doi.org/10.1109/eptc53413.2021.9663914
Publikováno v:
Journal of Electronic Packaging. 144
This work presents an approach to optimally designing a composite with thermal conductivity enhancers infiltrated with phase change material based on figure of merit (FOM) for thermal management of portable electronic devices. The FOM defines the bal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c220bdda32a646a2d9865ed34c522463
https://doi.org/10.1115/1.4052074
https://doi.org/10.1115/1.4052074
Autor:
Yaman M. Manaserh, Bharath Ramakrisnan, Yaser Hadad, Srikanth Rangarajan, Bahgat Sammakia, Scott N. Schiffres, Cong Hiep Hoang, Mohammad I. Tradat
The miniaturization of microelectronic devices and an increasing demand for faster computing results in high heat flux applications. By adopting direct liquid cooling, the high heat flux and high-power demands can be met. In this paper, thermo-hydrau
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::30d0eaeff3c5f652e563ee8fd4d65be8
https://doi.org/10.1115/1.0003630v
https://doi.org/10.1115/1.0003630v
