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pro vyhledávání: '"Srikant Samavedam"'
Autor:
Youngtag Woo, Jagar Singh, Geert Van der Plas, B. Senapati, Shan Gao, Jason Eugene Stephens, Adam Beece, Lu Yuan, Michelle Sureddin, Mahbub Rashed, Ali Wehbi, Srikant Samavedam, Van Ton-That, Irene Lin, Jongwook Kye, Donald Yu, Guillaume Bouche, Kanagala Vijay, Rod Augur, Peter Hang, Ramakanth Alapati, Dragomir Milojevic
Publikováno v:
International Symposium on Microelectronics. 2015:000035-000040
The traditional drivers for the adoption of 3D integration technology are footprint, power, performance, and/or bandwidth gains at the expense of increased cost due to additional wafer processing, dies stacking and 3D test. However, for larger dies i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b54567f4229b1e92787cabdee830b1b8
https://doi.org/10.4071/isom-2015-tp21
https://doi.org/10.4071/isom-2015-tp21
