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pro vyhledávání: '"Srihari, Krishnaswami"'
The placed electronic component can shift on the wet solder paste in pick and place (P&P) process of surface mount technology (SMT). It does not usually attract much attention, because the shift is considered to be negligibly small and the following
Externí odkaz:
http://arxiv.org/abs/2002.07807
In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process. This capability is known as self-alignment and is the result of fluid dynamic behaviour of molten solder paste. This capability is criti
Externí odkaz:
http://arxiv.org/abs/2001.09619
Autor:
Srihari, Krishnaswami
There exists today a variety of Computer Aided Process Planning (CAPP) systems that have been designed, developed, and implemented irrespective of the facility's condition and status. It is often found in practice that Computer Integrated Manufacturi
Externí odkaz:
http://hdl.handle.net/10919/87671
Autor:
Dauod, Husam, Serhan, Duaa, Wang, Haifeng, Khader, Nourma, Won Yoon, Sang, Srihari, Krishnaswami
Publikováno v:
In Robotics and Computer Integrated Manufacturing October 2019 59:177-188
Publikováno v:
In Procedia Manufacturing 2019 39:363-370
Autor:
Abbas, Abid-Alrahman Fawzi, Greene, Christopher M., Srihari, Krishnaswami, Santos, Daryl, Pandiarajan, Ganesh
Publikováno v:
In Procedia Manufacturing 2019 38:1138-1142
Publikováno v:
In Procedia Manufacturing 2019 38:447-454
Publikováno v:
In Computers & Industrial Engineering September 2018 123:42-53
Publikováno v:
In Procedia Manufacturing 2017 11:1782-1789
Publikováno v:
In Journal of Manufacturing Systems October 2015 37 Part 1:233-242