Zobrazeno 1 - 10
of 62
pro vyhledávání: '"Sridhar Canumalla"'
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
The solder joint reliability under thermomechanical fatigue is a very strong function of package size and thermal expansion mismatch for a large ceramic leadless chip carrier package (CLCC) with perimeter I/O. If these factors cannot be adjusted, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d0baf766527981e9af8674a837771b9
https://doi.org/10.1109/ectc.2016.223
https://doi.org/10.1109/ectc.2016.223
Publikováno v:
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The mechanical properties of polymer materials are often a key concern of the microelectronic packaging industry. The theoretical analysis of stress, strain, and deformation induced in electronic assemblies due to environmental exposures such as mois
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::924462e870258825b6389970eb0b656e
https://doi.org/10.1109/itherm.2014.6892302
https://doi.org/10.1109/itherm.2014.6892302
Publikováno v:
Journal of Engineering Materials and Technology. 119:143-147
Alumina-silicate inclusions (shot) have been found to adversely affect the mechanical properties of a short alumina-silicate fiber reinforced aluminum alloy (A356). To better understand the differences between the responses of the shot and fibers to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35e051516cf3b113818d94df580fa937
https://doi.org/10.1115/1.2805986
https://doi.org/10.1115/1.2805986
Publikováno v:
Materials Science and Engineering: A. 200:181-191
Microstructural damage mechanisms owing to thermal cycling and isothermal exposure at elevated temperature are studied for a short alumina-silicate fiber-reinforced aluminum alloy (A356) composite produced by pressure casting. The tensile strength of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d19eb4df68b3943f38827cf67fbccdab
https://doi.org/10.1016/0921-5093(95)07004-4
https://doi.org/10.1016/0921-5093(95)07004-4
Publikováno v:
Journal of Composite Materials. 29:653-670
Discontinuously reinforced aluminum alloys are viewed as candidate materials for elevated temperature applications because of their attractive high temperature strength properties and wear resistance. The elevated temperature elastic properties and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bff2137ed0d037a04b8290aa904fc1b
https://doi.org/10.1177/002199839502900506
https://doi.org/10.1177/002199839502900506
Publikováno v:
Composites Science and Technology. 52:607-614
The attractive elevated-temperature properties of metal-matrix composities (MMCs) have not been exploited in commercial applications partly because of the high processing cost and lack of reliability in fabrication. In this exploratory study, the fea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10249053d6b151e38e95610265f8cffb
https://doi.org/10.1016/0266-3538(94)90043-4
https://doi.org/10.1016/0266-3538(94)90043-4
Publikováno v:
Ultrasonics. 31:373-380
Advances in the field have enabled ultrasonic C-scan imaging to go beyond its classical application of detecting large single flaws to meet the challenge of non-destructive evaluation for modern engineered structures and new materials. Increased freq
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46f85b2457ca6f59696d351f5a4d89d5
https://doi.org/10.1016/0041-624x(93)90071-7
https://doi.org/10.1016/0041-624x(93)90071-7
Publikováno v:
Micro-and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ISBN: 9780387279749
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::024c9f1e91c1d36911a311d6a0476ca3
https://doi.org/10.1007/0-387-32989-7_30
https://doi.org/10.1007/0-387-32989-7_30
Publikováno v:
International Symposium for Testing and Failure Analysis.
The critical impact of corner voids on the anticipated reliability of CSP subjected to mechanical stresses is demonstrated in this paper. Experimental and numerical simulation results indicate that the presence of a corner underfill void subjects the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46a8e0cc132ca402a05c5026f2495080
https://doi.org/10.31399/asm.cp.istfa2002p0361
https://doi.org/10.31399/asm.cp.istfa2002p0361