Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Sreetharan Sekaran"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a27247e132fd0200dcd1707e42d0d5ad
https://doi.org/10.1109/eptc56328.2022.10013203
https://doi.org/10.1109/eptc56328.2022.10013203
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc11e3851b5f8e2d5918ea2af68396f2
https://doi.org/10.1109/ectc51906.2022.00326
https://doi.org/10.1109/ectc51906.2022.00326
Publikováno v:
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.
Most of the device's technology has been moving towards the complex and produce of Nano-IC with demands for cheaper cost, smaller size and better thermal and electrical performance. One of the marketable packages is Quad Flat No-Lead (QFN) package. D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97a6972172c6abf51c606ab5d80d3e5b
https://doi.org/10.1109/iemt.2016.7761936
https://doi.org/10.1109/iemt.2016.7761936