Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Sreejith Kochupurackal Rajan"'
Autor:
Sreejith Kochupurackal Rajan, Bharath Ramakrishnan, Husam Alissa, Washington Kim, Christian Belady, Muhannad S Bakir
Publikováno v:
IEEE Access, Vol 10, Pp 59259-59269 (2022)
The stagnation of Dennard scaling along with the move towards heterogeneous 2.5D and 3D ICs is increasing the thermal design power (TDP) envelopes of general-purpose CPUs. With conventional cooling approaches such as air-cooling and cold plates, it i
Externí odkaz:
https://doaj.org/article/de8f10f5c0de4700aa5359b347744449
Publikováno v:
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. :261-287
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eebda3bb24486b61707a35949c5b9712
https://doi.org/10.1002/9781119793908.ch11
https://doi.org/10.1002/9781119793908.ch11
Autor:
Ting Zheng, Muhannad S. Bakir, Sreejith Kochupurackal Rajan, Jonathan R. Brescia, Joe L. Gonzalez
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2069-2076
This paper presents a novel die-level, rePlaceable INtegrated CHiplet (PINCH) assembly using a socketed platform. To enable the replaceability of this tightly-integrated system, the appropriate set of enabling technologies is required. To this end, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba42133cb68055f2942685a03b45ae6a
https://doi.org/10.1109/tcpmt.2021.3118334
https://doi.org/10.1109/tcpmt.2021.3118334
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2061-2068
This paper presents a novel substrate-agnostic self-alignment technology with submicron alignment accuracy targeted for heterogeneous integrated systems. This self-alignment technology, referred to as PSAS-to-PSAS self-alignment, incorporates positiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07c9ee7e3b307dc524a21772a67f9cf3
https://doi.org/10.1109/tcpmt.2021.3109913
https://doi.org/10.1109/tcpmt.2021.3109913
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1824-1834
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0006fc9b21769bc4bf052afecad9184b
https://doi.org/10.1109/tcpmt.2021.3113886
https://doi.org/10.1109/tcpmt.2021.3113886
Autor:
Muhannad S. Bakir, Joe L. Gonzalez, Gary S. May, Jessica D. Falcone, Maysam Ghovanloo, Ravi V. Bellamkonda, Pyungwoo Yeon, Sreejith Kochupurackal Rajan, Oliver Brand
Publikováno v:
IEEE Sensors Journal. 21:13837-13848
This paper presents a new micromachining (MEMS) fabrication, microassembly, and hermetic packaging process for free-floating neural probes ( $1.3\times1.3$ mm2 bath-tub shaped micromachined silicon die, which serves as a substrate that supports all p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fcb27c48d7c9b429f6439d88da6f6411
https://doi.org/10.1109/jsen.2021.3068077
https://doi.org/10.1109/jsen.2021.3068077
Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:974-982
Heterogeneous integration techniques such as 2.5-D system-in-packages (SiPs) present new challenges that include higher aggregate package power as well as increased thermal crosstalk between different chiplets due to their proximity. This creates the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c1a7f40870e49d82b59d32d581fc712
https://doi.org/10.1109/tcpmt.2021.3082013
https://doi.org/10.1109/tcpmt.2021.3082013
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1474-1481
A polylithic integration technology called heterogeneous interconnect stitching technology (HIST) is explored in this article. HIST provides both 2.5-D and 3-D integration capabilities enabled by multi-height and fine-pitch compressible microintercon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a24f9d9140ae8197432145f1c083f6ab
https://doi.org/10.1109/tcpmt.2020.3011325
https://doi.org/10.1109/tcpmt.2020.3011325
Publikováno v:
2021 IEEE International 3D Systems Integration Conference (3DIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45251ceb02086c1825b782542702ee8a
https://doi.org/10.1109/3dic52383.2021.9687618
https://doi.org/10.1109/3dic52383.2021.9687618
Autor:
Aravind Dasu, Thomas E. Sarvey, Sreejith Kochupurackal Rajan, Gutala Ravi Prakash, Ankit Kaul, Muhannad S. Bakir
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:2393-2403
The 2.5-D integration is becoming a common method of tightly integrating heterogeneous dice with dense interconnects for efficient, high-bandwidth inter-die communication. While this tight integration improves performance, it also increases the chall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19aa2ea5bfc9c68ec24f068cbf59c1b3
https://doi.org/10.1109/tcpmt.2019.2930481
https://doi.org/10.1109/tcpmt.2019.2930481