Zobrazeno 1 - 10
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pro vyhledávání: '"Spirin V"'
Autor:
Spirin V. G.
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 5, Pp 24-27 (2013)
The paper presents microassembly design and technology for accelerometer, carried out on a silicon plate with three commutation levels and thin film resistors on both of its surfaces.
Externí odkaz:
https://doaj.org/article/a62a342c487d4afa83cbca3e79627ce1
Autor:
Spirin V. G.
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 5, Pp 3-7 (2012)
Three design and technological versions of multilayer circuit have been developed. The interlayer and protective isolation in these circuits was performed with thick (10—30 micron) heat-resistant photosensitive organic dielectric film. Such perform
Externí odkaz:
https://doaj.org/article/948d94908cc549e982dfe35b15252d44
Autor:
Spirin V. G.
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 3, Pp 31-34 (2012)
A method for estimation of the quality of a thin-film board has been developed, based on the results of resistance measuring and instrumental errors calculation. Recommendations are given for the exclusion of gross errors in the application of the me
Externí odkaz:
https://doaj.org/article/4bbeddfcf9684a018cce0daf5a2ce441
Autor:
Spirin V. G.
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 6, Pp 9-14 (2009)
The physical and mathematical models of electrode impedance for the thin-film resistors of rectangular and interdigital shapes are presented in this work. The impact of electrode impedance on the manufacturing and temperature errors is estimated.
Externí odkaz:
https://doaj.org/article/5366a44d138e4b7b9e2832fac67040b6
Autor:
Spirin V. G.
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 5, Pp 20-23 (2008)
The analytical model of the calculation of the contact resistance of the thin-film resistor is Offered. The Explored dependency of the contact resistance from wedge of the pickling. The Considered influence adhesive layer on warm-up stability of the
Externí odkaz:
https://doaj.org/article/dd1d8d6312f14805ae1f33cd63283f38
Autor:
Spirin V. G.
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 5, Pp 42-44 (2009)
A relationship between a thin-film resistor resistance error and mask misalignment with a substrate conductive layer at the second photolithography stage for a thin-film resistor design in which the resistive element does not overlap conductor pads i
Externí odkaz:
https://doaj.org/article/eec6459a69524da39d9f6cf185bfb29c
Autor:
Spirin V. G.
Publikováno v:
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 4, Pp 42-43 (2013)
The author considers the design and operation of two devices for quality control of welded joints between aluminum leads of packageless microcircuits and contact pads of a thin-film circuit.
Externí odkaz:
https://doaj.org/article/40546b0d1e6048c9b2a8cb556df849f7
Akademický článek
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Publikováno v:
Phys. Rev. E 65, 016119 (2002).
We investigate the final state of zero-temperature Ising ferromagnets which are endowed with single-spin flip Glauber dynamics. Surprisingly, the ground state is generally not reached for zero initial magnetization. In two dimensions, the system eith
Externí odkaz:
http://arxiv.org/abs/cond-mat/0105037
Publikováno v:
Phys. Rev. E 63, 036118 (2001).
We investigate the relaxation of homogeneous Ising ferromagnets on finite lattices with zero-temperature spin-flip dynamics. On the square lattice, a frozen two-stripe state is apparently reached approximately 1/4 of the time, while the ground state
Externí odkaz:
http://arxiv.org/abs/cond-mat/0008019