Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Sourabh Kulkarni"'
Autor:
Anand. S. Garampalli, Sourabh Kulkarni
Publikováno v:
PARIPEX INDIAN JOURNAL OF RESEARCH. :13-20
Background & Objective: Distal radius fractures are most frequently encountered fractures accounting for 17.5% of all fractures in adults. Majority of them are intra-articular. The management has changed from conservative to operative management with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ce250f5f3c17b7be6234bbccc7a8058
https://doi.org/10.36106/paripex/0600508
https://doi.org/10.36106/paripex/0600508
Publikováno v:
International Journal of Healthcare Management. :1-9
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c812f67d9758b64278525f489483a6a4
https://doi.org/10.1080/20479700.2022.2163866
https://doi.org/10.1080/20479700.2022.2163866
Publikováno v:
Materials Today: Proceedings. 72:878-883
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7af8848e74d9a5ff44fc9797586a54a3
https://doi.org/10.1016/j.matpr.2022.09.085
https://doi.org/10.1016/j.matpr.2022.09.085
Autor:
Sourabh Kulkarni, Csaba Andras Moritz
Publikováno v:
IEEE Transactions on Parallel and Distributed Systems. :1-15
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4757a528699260dc06fbb5b9132b461
https://doi.org/10.1109/tpds.2023.3238045
https://doi.org/10.1109/tpds.2023.3238045
Thermal management in 3D integrated circuits is a critical challenge due to their high computational density. Heat dissipation paths from top circuit layers through bottom layers to substrate are heavily constraining heat extraction. Various thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cabc2daf991cca7e0dcd74a79ba822d3
https://doi.org/10.36227/techrxiv.21342933
https://doi.org/10.36227/techrxiv.21342933
Publikováno v:
ACM Journal on Emerging Technologies in Computing Systems. 17:1-33
Artificial Intelligence is becoming ubiquitous in products and services that we use daily. Although the domain of AI has seen substantial improvements over recent years, its effectiveness is limited by the capabilities of current computing technology
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::148fbc31db63d7038b4b33d872860641
https://doi.org/10.1145/3445977
https://doi.org/10.1145/3445977
Autor:
Shruti V. Dikshit, Shriramshastri Chavali, Prateek D. Malwe, Sourabh Kulkarni, Hitesh Panchal, Ali Jawad Alrubaie, Mohamed A. Mohamed, Mustafa Musa Jaber
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering. :095440892311630
In comfort, air-conditioning control over the humidity is essential in applications such as pharmaceutical industries, electronic gadgets manufacturing units, the food sector, paper industries, etc. Relative humidity of nearly 50% can effectively pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9dfaab156decf7a86215b4554e4b993
https://doi.org/10.1177/09544089231163024
https://doi.org/10.1177/09544089231163024
Autor:
Ramaswamy Nagarajan, Sourabh KULKARNI, Julie St. Cyr, Zhiyu Xia, Ryan Bouldin, Jayant Kumar, Ravi Mosurkal
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f95ac31626c3a299e31c0a38e7ad7b6
https://doi.org/10.2139/ssrn.4163546
https://doi.org/10.2139/ssrn.4163546
Publikováno v:
ISVLSI
For sub-5nm technology nodes, gate-all-around (GAA) FETs are positioned to replace FinFETs to enable the continued miniaturization of ICs in the future. In this paper, we introduce SkyBridge-3D-CMOS 2.0, a 3D-IC technology featuring integration of st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::debdaa1ea762027b1ca587edb3af3450
https://doi.org/10.1109/isvlsi51109.2021.00041
https://doi.org/10.1109/isvlsi51109.2021.00041
Publikováno v:
ISQED
Three-dimensional integrated circuits (3D-ICs) provide a feasible path for scaling CMOS technology in the foreseeable future. IMEC and IRDS roadmaps project that 3D integration is a key avenue for the IC industry beyond 2024. They project that some f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64966d09e8ae2b1bb427064b459d2998
https://doi.org/10.1109/isqed51717.2021.9424282
https://doi.org/10.1109/isqed51717.2021.9424282