Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Soshi Iwatsuki"'
Publikováno v:
International Journal of Automation Technology. 15:483-491
In laser cleaving, the thermal stress caused by laser heating and water-jet cooling propagates previously induced cracks in the workpiece material. The laser-cleaving conditions affect the quality of the fracture surface, and therefore, elucidating t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8f40e70684f51b803c4f2865ded68cf
https://doi.org/10.20965/ijat.2021.p0483
https://doi.org/10.20965/ijat.2021.p0483
Publikováno v:
Precision Engineering. 64:122-128
Laser cleaving is a glass-cutting technique in which thermal stress induced by laser heating and cooling produces cracks in the glass. Stress measurement during the laser cleaving process is critical in elucidating the crack-propagation mechanism and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b907ea69ff900c94eeddbde98a6ebf2b
https://doi.org/10.1016/j.precisioneng.2020.03.019
https://doi.org/10.1016/j.precisioneng.2020.03.019