Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Sooryong Lee"'
Autor:
Yunhyoung Nam, Do-Nyun Kim, Ki-Hyun Kim, Ji-Suk Hong, Sooryong Lee, Jaehoon Kim, Min-Cheol Kang
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 34:365-371
Detecting defects in the inspection stage of semiconductor manufacturing process is a crucial task to improve yield and productivity as well as wafer quality. Recent Advances in semiconductor process technology have greatly increased the transistor d
Autor:
Jiyoon Chang, Minsung Kim, Lee Sang-Hwa, Chang-Soo Kim, Minsu Oh, Jun Ye, Sooryong Lee, Sangwoo Park, Robert Boone, Seungjong Lee, Stanislas Baron, Jungmin Kim, Youngmi Kim, Na-Rae Bang, Pengcheng Li, No-Young Chung, Xinxin Zhou, Rachit Gupta
Publikováno v:
Extreme Ultraviolet (EUV) Lithography XI.
With conventional methods, improvements in optical proximity correction (OPC) runtime and accuracy can be challenging. Often improvements in accuracy have limited impact or require longer runtimes. Conversely, improvements in runtime often come at a
Autor:
Woojoo Sim, Sooryong Lee, Ji-Suk Hong, Dingdong Yang, Honglak Lee, Kibok Lee, Jae-Seung Jeong
Publikováno v:
Optical Microlithography XXXII.
Deep learning has recently been successfully applied to lithography hotspot detection. However, automatic correction of the detected hotspots into non-hotspots has not been explored. This problem is challenging because the standard supervised learnin
Publikováno v:
Optical Microlithography XXXI.
As semiconductor product development based on shrinkage continues, the accuracy and difficulty required for the model based optical proximity correction (MBOPC) is increasing. OPC simulation time, which is the most timeconsuming part of MBOPC, is rap
Autor:
Park Seong-Yul, Sooryong Lee, Kareem Madkour, Joe Kwan, Ho-Kyu Kang, Seung-Hune Yang, Joong-Won Jeon, SeungJo Lee, Jaewan Song, Wael ElManhawy, Jeong-Lim Kim
Publikováno v:
SPIE Proceedings.
Due to limited availability of DRC clean patterns during the process and RET recipe development, OPC recipes are not tested with high pattern coverage. Various kinds of pattern can help OPC engineer to detect sensitive patterns to lithographic effect
Autor:
Jennifer Dworak, B. Stewart, M.R. Mercer, Li-C. Wang, Michael R. Grimaila, Kenneth M. Butler, J.D. Wicker, Sooryong Lee
Publikováno v:
IEEE Design & Test of Computers. 18:31-41
After an integrated circuit (IC) design is complete, but before first silicon arrives from the manufacturing facility, the design team prepares a set of test patterns to isolate defective parts. Applying this test pattern set to every manufactured pa
Autor:
Kyoil Koo, Gyengseop Kim, Jung-Dal Choi, Seung-Hune Yang, Ho-Kyu Kang, Sang-hun Kim, Sooryong Lee, Young-Chang Kim
Publikováno v:
SPIE Proceedings.
Most important factors in OPC model building will be sampling data for model calibration. We will demonstrate that how CD-AFM data can be used in OPC modeling and will show possibility to get a more predictive model by using CD-AFM data.
Autor:
Seung-Hune Yang, Dmitry Vengertsev, Jung-Dal Choi, Ki-Hyun Kim, Sooryong Lee, Seongbo Shim, Artem Shamsuarov, Seong-Woon Choi, Ho-Kyu Kang, Seongho Moon
Publikováno v:
SPIE Proceedings.
Model-based Optical Proximity Correction (OPC) is widely used in advanced lithography processes. The OPC model contains an empirical part, which is calibrated by fitting the model with data from test patterns. Therefore, the success of the OPC model
Publikováno v:
SPIE Proceedings.
A negative tone development (NTD) process has been considered as apromising candidate for the smaller contact solution due to the remarkable image quality over a positive tone develop (PTD) process. However, it has not been investigated why NTD has h
Autor:
Tom Cecil, Hyong-Euk Lee, M. J. Hong, Bob Gleason, Xin Zhou, Donghwan Son, David Irby, Guangming Xiao, Sooryong Lee, Sunhwa Jung, Sungsoo Suh, Woojoo Sim, Chris Ashton, David Kim, Lan Luan
Publikováno v:
SPIE Proceedings.
It is well known in the industry that the technology nodes from 30nm and below will require model based SRAF / OPC for critical layers to meet production required process windows. Since the seminal paper by Saleh and Sayegh[1][2] thirty years ago, th