Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Soo-Beom Jo"'
Fabrication of vertical optical interconnecting structure using photoresist reflowed mold structures
Autor:
Bo-Soon Kim, Min-Woo Lee, El-Hang Lee, Beom-Hoan O, Jeong-Su Yang, Seung-Gol Lee, Se-Geun Park, Soo-Beom Jo, Jun-Ho Sung, Chul-Hyun Choi
Publikováno v:
Microelectronic Engineering. 84:1092-1095
This paper demonstrates a simple fabrication process of an optical via structure which includes curved optical reflector. The fabrication process consists of two separate processes. Initially, the device master structure, for subsequent embossing pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df3af363afd224d03b525c157dc875f2
https://doi.org/10.1016/j.mee.2007.01.075
https://doi.org/10.1016/j.mee.2007.01.075
Publikováno v:
Surface and Coatings Technology. :452-458
We present the results of our development of deep silicon etching process and surface treatment method for 40∼50 μm deep silicon mold. Silicon mold was fabricated with conventional photolithography and deep silicon etching. A ‘modified Bosch pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df8370f9e5a8ab5fc3a6a508f7af988f
https://doi.org/10.1016/j.surfcoat.2004.08.052
https://doi.org/10.1016/j.surfcoat.2004.08.052
Publikováno v:
Surface and Coatings Technology. :528-531
The enhanced ICP (E-ICP) etcher with various magnetization frequency of external coil current has shown improved etch characteristics in silicon dioxide etch with CF 4 gas, and it improves the etch rate of silicon dioxide with the C 4 F 8 gas also. I
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e7e082d3509c2438fc65c7ca86aade5
https://doi.org/10.1016/s0257-8972(01)01464-5
https://doi.org/10.1016/s0257-8972(01)01464-5
Autor:
Seung-Gol Lee, Se-Geun Park, El-Hang Lee, Beom-Hoan O, Soo-Beom Jo, Chul-Hyun Choi, Min-Woo Lee
Publikováno v:
SPIE Proceedings.
A vertically interconnected structure is a key feature of a photonic integrated circuit application, like an optical printed circuit board. Conventional vertical interconnecting structures have a 45 degree mirror, with or without metal coating to enh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::959c8551891b90f944ac4f448a59ac38
https://doi.org/10.1117/12.592134
https://doi.org/10.1117/12.592134
Autor:
Beom-hoan O, Chul-Hyun Choi, Soo-Beom Jo, Min-Woo Lee, Dong-Gue Park, Byeong-Gwon Kang, Sun-Hyung Kim, Rong Liu, Yang Yang Li, M.J. Sailor, Y. Fainman
Publikováno v:
IEEE Photonics Technology Letters; Jun2004, Vol. 16 Issue 6, p1546-1548, 3p