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pro vyhledávání: '"Soo San Park"'
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
The skyrocketing price of gold has driven the rapid adoption of copper wire in semiconductor packaging. Cu wire is being used for increasingly advanced applications requiring copper wire bond to finer bond pad geometries and structures. Palladium coa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdacf54619dec2af0eaab1393352c5e2
https://doi.org/10.1109/ectc.2012.6249104
https://doi.org/10.1109/ectc.2012.6249104
