Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Somani, Ajay"'
Autor:
Zhao, Mark, Choudhary, Dhruv, Tyagi, Devashish, Somani, Ajay, Kaplan, Max, Lin, Sung-Han, Pumma, Sarunya, Park, Jongsoo, Basant, Aarti, Agarwal, Niket, Wu, Carole-Jean, Kozyrakis, Christos
We present RecD (Recommendation Deduplication), a suite of end-to-end infrastructure optimizations across the Deep Learning Recommendation Model (DLRM) training pipeline. RecD addresses immense storage, preprocessing, and training overheads caused by
Externí odkaz:
http://arxiv.org/abs/2211.05239
Autor:
Somani, Ajay
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2007.
Includes bibliographical references (p. 221-231).
Along with scaling down in size, novel materials have been introduced into the semic
Includes bibliographical references (p. 221-231).
Along with scaling down in size, novel materials have been introduced into the semic
Externí odkaz:
http://hdl.handle.net/1721.1/40350
Publikováno v:
Krishnan, Nikhil; Boyd, Sarah; Somani, Ajay; & Dornfeld, David. (2008). A Hybrid Life Cycle Inventory of Nano-Scale Semiconductor Manufacturing. Laboratory for Manufacturing and Sustainability. UC Berkeley: Laboratory for Manufacturing and Sustainability. Retrieved from: http://www.escholarship.org/uc/item/7931209f
The manufacturing of modern semiconductor devices involves a complex set of nanoscale fabrication processes that are energy and resource intensive, and generate significant waste. It is important to understand and reduce the environmental impacts of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______325::616a7913748ddeeab40cdcb5e09fb5f7
http://www.escholarship.org/uc/item/7931209f
http://www.escholarship.org/uc/item/7931209f
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Krishnan N; Columbia University, New York, NY, USA. nk2162@columbia.edu, Boyd S, Somani A, Raoux S, Clark D, Dornfeld D
Publikováno v:
Environmental science & technology [Environ Sci Technol] 2008 Apr 15; Vol. 42 (8), pp. 3069-75.