Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Solder reliability"'
Autor:
Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, Michael Weser, Wael G. Al-Kouz, Maen S. Sari, Ibrahim Alhoweml
Publikováno v:
Nanomaterials, Vol 9, Iss 10, p 1478 (2019)
In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical resistan
Externí odkaz:
https://doaj.org/article/a34a7b2278d9462bb37199003a22007d
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
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Autor:
Soares, Delfim, Ribeiro, Pedro E., Capela, Pauline, Barros, Daniel A., Cerqueira, M. F., Teixeira, S. F. C. F., Macedo, Francisco, Teixeira, J. Carlos
During the life cycle of an electronic printed circuit boards (PCBs), the cold solder joints formation between the component and PCB are a failure mode that happen commonly. This phenomenon is related to solder joint fatigue and is attributed mainly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______307::de308fec824d7bec3fcf3d108449d4eb
https://hdl.handle.net/1822/72028
https://hdl.handle.net/1822/72028
Autor:
Abdulaziz N. Alhazaa, Anas M. Atieh, Wael Al-Kouz, Michael Weser, Tala J Abedalaziz, Ma’en S. Sari, Ibrahim Alhoweml
Publikováno v:
Nanomaterials
Volume 9
Issue 10
Nanomaterials, Vol 9, Iss 10, p 1478 (2019)
Volume 9
Issue 10
Nanomaterials, Vol 9, Iss 10, p 1478 (2019)
In this study, the effects of adding Sn nanopowder (particle size <
150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical r
150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::752e087367e08413ad9178c0a157d01c
Autor:
Ribeiro, Pedro Emanuel Abreu, Soares, Delfim, Cerqueira, M. F., Teixeira, S. F. C. F., Barros, Daniel Araújo, Teixeira, J. Carlos
A common failure mode of electronic PCB’s is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______307::002a1febb07df637f4d789b8d5600e69
https://hdl.handle.net/1822/53400
https://hdl.handle.net/1822/53400
Autor:
Ribeiro, Pedro Emanuel Abreu, Soares, Delfim, Cerqueira, M. F., Teixeira, S. F. C. F., Barros, Daniel Araújo, Teixeira, J. Carlos, Capela, Paulina Araújo, Macedo, Francisco
A common failure mode of electronic printed circuit boards (PCB’s) is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______307::aa0e31a2bd6b736da1e419600daa08f6
https://hdl.handle.net/1822/71714
https://hdl.handle.net/1822/71714
Akademický článek
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K zobrazení výsledku je třeba se přihlásit.
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Solid-state lighting (SSL), which is based 0n semiconductor Lighting Emitting Diode (LED), is the most promising and reliable energy saving solution for future lighting applications. Since a bare LED die can hardly survive without a package, one of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dris___00893::43b841208099a50b7b254234e6ed6a80
http://resolver.tudelft.nl/uuid:bf95c658-555a-45ee-a07e-394dfddd74ac
http://resolver.tudelft.nl/uuid:bf95c658-555a-45ee-a07e-394dfddd74ac
Autor:
Zhang, J.
Publikováno v:
None
Solid-state lighting (SSL), which is based 0n semiconductor Lighting Emitting Diode (LED), is the most promising and reliable energy saving solution for future lighting applications. Since a bare LED die can hardly survive without a package, one of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e34ab4c257ecefbed09ccd97f1874eff