Zobrazeno 1 - 10
of 5 998
pro vyhledávání: '"Solder pastes"'
Autor:
Wang, Jiajun1 (AUTHOR), Peng, Jubo1 (AUTHOR), Cai, Shanshan1 (AUTHOR) sscai10s@alum.imr.ac.cn, Wang, Xiaojing2 (AUTHOR) wxj@just.edu.cn
Publikováno v:
Journal of Materials Science. Feb2023, Vol. 58 Issue 5, p2347-2359. 13p. 3 Diagrams, 6 Charts, 9 Graphs.
Autor:
Zhang, Peng1 (AUTHOR), Xue, Songbai1 (AUTHOR) xuesb@nuaa.edu.cn, Liu, Lu1 (AUTHOR), Wu, Jie1 (AUTHOR), Luo, Qingcheng1 (AUTHOR), Wang, Jianhao2 (AUTHOR)
Publikováno v:
Polymers (20734360). Dec2022, Vol. 14 Issue 23, p5303. 13p.
Autor:
Zhang, Peng1,2 (AUTHOR), Xue, Songbai1 (AUTHOR) xuesb@nuaa.edu.cn, Liu, Lu3 (AUTHOR), Wang, Jianhao2 (AUTHOR), Tatsumi, Hiroaki2 (AUTHOR), Nishikawa, Hiroshi2 (AUTHOR)
Publikováno v:
Polymers (20734360). Sep2024, Vol. 16 Issue 18, p2597. 18p.
Autor:
Dziurdzia, Barbara1 (AUTHOR) dziurd@agh.edu.pl, Sobolewski, Maciej2 (AUTHOR) maciej.sobolewski@fideltronik.com, Mikołajek, Janusz3 (AUTHOR) janusz.mikolajek@fideltronik.com, Wroński, Sebastian4 (AUTHOR) sebastian.wronski@agh.edu.pl
Publikováno v:
Soldering & Surface Mount Technology. 2020, Vol. 32 Issue 4, p201-217. 17p.
Autor:
Guéné, Emmanuelle1, Teh, Steven2
Publikováno v:
SMT: Surface Mount Technology. Apr2015, Vol. 30 Issue 4, p26-40. 12p.
Publikováno v:
Productronic. 6/4/2024, p18-20. 3p.
Publikováno v:
Productronic. 12/3/2024, p44-45. 2p.