Zobrazeno 1 - 10
of 3 047
pro vyhledávání: '"Solder joint"'
Autor:
Apalowo, Rilwan Kayode, Muhamed Mukhtar, Muhamed Abdul Fatah, Abas, Mohamad Aizat, Che Ani, Fakhrozi
Publikováno v:
Soldering & Surface Mount Technology, 2024, Vol. 36, Issue 5, pp. 309-322.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-04-2024-0020
Autor:
Norliza Ismail, Wan Yusmawati Wan Yusoff, Azuraida Amat, Nor Azlian Abdul Manaf, Nurazlin Ahmad
Publikováno v:
Defence Technology, Vol 41, Iss , Pp 134-158 (2024)
Solder joint, crucial component in electronic systems, face significant challenges when exposed to extreme conditions during applications. The solder joint reliability involving microstructure and mechanical properties will be affected by extreme con
Externí odkaz:
https://doaj.org/article/8e44584a0a424547a43d638ba0ea0bf3
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-12 (2024)
Abstract Printed Circuit Boards (PCBs) are the foundational component of electronic devices, and the detection of PCB defects is essential for ensuring the quality control of electronic products. Aiming at the problem that the existing PCB plug-in so
Externí odkaz:
https://doaj.org/article/9fc7c8a8262340f2aa20659d86c3edb4
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-14 (2024)
Abstract To mitigate the decrease in mechanical performance of Sn58Bi/Cu solder joints resulting from electromigration-induced damage. The CeO2 nanoparticles were incorporated into Sn58Bi solder by a melt-casting method, and their effects on the micr
Externí odkaz:
https://doaj.org/article/b23ca1fb7499451e81ac3157e5cc6975
Autor:
Apalowo, Rilwan Kayode, Abas, Mohamad Aizat, Che Ani, Fakhrozi, Mukhtar, Muhamed Abdul Fatah Muhamed, Ramli, Mohamad Riduwan
Publikováno v:
Soldering & Surface Mount Technology, 2024, Vol. 36, Issue 3, pp. 154-164.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-12-2023-0075
Publikováno v:
Archives of Metallurgy and Materials, Vol vol. 69, Iss No 2, Pp 661-665 (2024)
This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray radiation tomography. Synchrotron X-ray tomography is increasingly utilized for characterizing th
Externí odkaz:
https://doaj.org/article/8e8b7d56d0f14fbebfdfbfeedb05e5e3
Autor:
Yingde Miao, Tinghao Dong, Caiju Li, Jiaojiao Yang, Qiong Lu, Zunyan Xu, Xin Zhang, Jubo Peng, Jianhong Yi
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 9494-9502 (2024)
This study investigated the influence of Sb addition on the microstructure, thermal behavior, mechanical properties, and interfacial evolution of SAC305-2Bi-xSb/Cu solder joints. Compared with the SAC305-2Bi alloy, the melting temperature and pasty r
Externí odkaz:
https://doaj.org/article/65f727b0b1ac4d45ad13fca9205f5781
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 8915-8924 (2024)
Power electronic devices face harsh radiation environments in deep space exploration. It is significant to study the reliability of solder joints of electronic devices in radiation environments. The effect of electron irradiation on the microstructur
Externí odkaz:
https://doaj.org/article/491a623ff7574271b4d0c0d72581a557
Autor:
Xingchao Mao, Yuxuan An, Yang Chen, Gong Zheng, Rui Hou, Xinyu Zhang, Yuzheng Guo, Sheng Liu, King-Ning Tu, Yingxia Liu
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 1136-1147 (2024)
As advanced silicon manufacturing processes slow down in scaling, three-dimensional stacking of chips has become a future trend in microelectronic industry. High-density bonding technology is one of the core technologies used to achieve the stacking.
Externí odkaz:
https://doaj.org/article/6ea9871ac1d24dda8666d4f3e8c3f453
Autor:
Nourani, Amir1 nourani@sharif.edu, Mirmehdi, Sadegh1, Farrahi, Gholamhossein1, Soroush, Farid1
Publikováno v:
Fatigue & Fracture of Engineering Materials & Structures. Feb2019, Vol. 42 Issue 2, p425-438. 14p. 7 Diagrams, 11 Charts, 3 Graphs.