Zobrazeno 1 - 10
of 1 004
pro vyhledávání: '"Solder alloy"'
Autor:
Norliza Ismail, Wan Yusmawati Wan Yusoff, Nor Azlian Abdul Manaf, Azuraida Amat, Nurazlin Ahmad, Emee Marina Salleh
Publikováno v:
Defence Technology, Vol 39, Iss , Pp 86-102 (2024)
In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solde
Externí odkaz:
https://doaj.org/article/cfef1253c1ce41e8a5be61dbc6dde1d7
Publikováno v:
Journal of Materials Research and Technology, Vol 32, Iss , Pp 609-620 (2024)
In this paper, novel application possibilities of CuO nanoparticles were investigated in SAC0307 solder alloy for composite soldering purposes. CuO nanoparticles in 0.25 and 0.5 wt% were mixed into the solder paste to produce composite solder joints.
Externí odkaz:
https://doaj.org/article/57ce477142754ba89ea5bd4461a3b981
Autor:
Ruiz-Jacinto, Vicente-Segundo, Gutiérrez-Valverde, Karina-Silvana, Aslla-Quispe, Abrahan-Pablo, Burga-Falla, José-Manuel, Alarcón-Sucasaca, Aldo, Huamán-Romaní, Yersi-Luis
Publikováno v:
Soldering & Surface Mount Technology, 2023, Vol. 36, Issue 2, pp. 69-79.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2023-0045
Autor:
Jianglei Fan, Jiaojiao Wang, Xiao Wang, Zhanyun Liu, Shen Wu, Yan Wang, Ying Li, Xiangkui Zhou, Shizhong Wei
Publikováno v:
Journal of Materials Research and Technology, Vol 29, Iss , Pp 2585-2596 (2024)
Improving mechanical properties of solder alloy can result in a decrease of its conductivity. The decrease in conductivity of the solder increases the generation of Joule heat and reduces the reliability of the joint. This problem can be solved by ad
Externí odkaz:
https://doaj.org/article/71ccc14620dd4cfe9d81e49713442696
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 5607-5614 (2023)
In this work, the influence of bias and electric field intensity on the electrochemical migration of SAC305 solder alloy is investigated using a self-designed in-situ thin electrolyte film device. The results indicate that when the bias is 0.5 V, a c
Externí odkaz:
https://doaj.org/article/dc17e6455ef544f6ae8aa1195f4e9ccf
Autor:
Jana Körmendy, Ján Vavro
Publikováno v:
Applied Sciences, Vol 14, Iss 18, p 8257 (2024)
The restriction of lead content in alloys for the production of solder, based on the Directive of the European Parliament and of the Council of the European Union of 8 June 2011, which is also known as RoHS (Restriction of the use of certain Hazardou
Externí odkaz:
https://doaj.org/article/a6405db9648c4ad4911089280f8b29c9
Autor:
Tianhan Hu, Shun Li, Zhen Li, Guanzhi Wu, Ping Zhu, Wufeng Dong, Yu Sun, Jiayi Zhou, Bingjia Wu, Bingge Zhao, Kai Ding, Yulai Gao
Publikováno v:
Journal of Materials Research and Technology, Vol 26, Iss , Pp 5902-5909 (2023)
The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced wi
Externí odkaz:
https://doaj.org/article/dfc43d9535f044e594db1fc0de0785ac
Publikováno v:
Soldering & Surface Mount Technology, 2023, Vol. 35, Issue 4, pp. 208-217.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2022-0054
Publikováno v:
Metals, Vol 14, Iss 6, p 689 (2024)
Zn-Al alloy with the addition of Al (5–25 wt.%) was fabricated into as–cast and rod–shaped alloys. SEM/EDS and XRD technology were used to examine the impacts of the Al–element content on the alloys’ microstructure, mechanical characteristi
Externí odkaz:
https://doaj.org/article/ec0a8b22bc684b0398f315ef8c995989
Publikováno v:
Micromachines, Vol 15, Iss 6, p 743 (2024)
The technology to jet print metal lines with precise shape fidelity on diverse substrates is gaining higher interest across multiple research fields. It finds applications in additively manufactured flexible electronics, environmentally friendly and
Externí odkaz:
https://doaj.org/article/96fe0da3298944679877f2f654d23a1f