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pro vyhledávání: '"Sohye Cho"'
Autor:
Sohye Cho
Publikováno v:
Journal for german Culture and Literature. 30:109-138
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::811d78ff0f37a11d82e4c6d2e5cd67fb
https://doi.org/10.32681/jgcl.30.5
https://doi.org/10.32681/jgcl.30.5
Autor:
Lee Hakseung, Yi-koan Hong, Hyokyung Cho, SeonKwan Hwang, Tae-Seong Kim, Hoon-joo Na, Kyu-Ha Lee, Ki-Hyun Hwang, Sohye Cho, Kwang-jin Moon
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
3D Multi-stacking technology using Cu-Cu hybrid wafer bonding has been developed to achieve superior power, speed performances and higher density with minimized form factor. To realize multi-stacked device by using Wafer on wafer (WoW) bonding, both
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06af239fac598003ea86a1022c8b0e0d
https://doi.org/10.1109/ectc32696.2021.00076
https://doi.org/10.1109/ectc32696.2021.00076