Zobrazeno 1 - 10
of 78
pro vyhledávání: '"Snoeij, M.F."'
Autor:
Sommer, Kélian1 (AUTHOR) bertrand.plez@umontpellier.fr, Plez, Bertrand1 (AUTHOR) johann.cohen-tanugi@in2p3.fr, Cohen-Tanugi, Johann1,2 (AUTHOR), Dagoret-Campagne, Sylvie3 (AUTHOR), Moniez, Marc3 (AUTHOR), Neveu, Jérémy3,4 (AUTHOR), Betoule, Marc4 (AUTHOR), Bongard, Sébastien4 (AUTHOR), Feinstein, Fabrice5 (AUTHOR), Le Guillou, Laurent4 (AUTHOR), Juramy, Claire4 (AUTHOR), Sepulveda, Eduardo4 (AUTHOR), Souverin, Thierry4 (AUTHOR)
Publikováno v:
Sensors (14248220). Jul2024, Vol. 24 Issue 14, p4498. 23p.
Autor:
Hu, Douming1 (AUTHOR), Yao, Libin1 (AUTHOR) libin_yao@163.com, Chen, Nan1 (AUTHOR), Zhang, Jiqing1 (AUTHOR), Zhong, Shengyou1 (AUTHOR), Mao, Wenbiao1 (AUTHOR), Zhu, Fang1 (AUTHOR), Zhang, Juan1 (AUTHOR)
Publikováno v:
Sensors (14248220). Jun2024, Vol. 24 Issue 11, p3653. 15p.
Publikováno v:
2011 Proceedings of the ESSCIRC (ESSCIRC); 2011, p319-322, 4p
Publikováno v:
2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers; 2008, p62-595, 534p
Publikováno v:
ESSCIRC 2008 - 34th European Solid-State Circuits Conference; 2008, p310-313, 4p
Publikováno v:
2007 IEEE Sensors; 2007, p523-526, 4p
Publikováno v:
2006 IEEE International Solid State Circuits Conference - Digest of Technical Papers; 2006, p2014-2023, 10p
Autor:
Makinwa, K.A.A., Snoeij, M.F.
Publikováno v:
2006 IEEE International Solid State Circuits Conference - Digest of Technical Papers; 2006, p1141-1150, 10p
Autor:
Rinaldi, Nicola1 (AUTHOR) nrinaldi@unisa.it, Liguori, Rosalba1 (AUTHOR) rliguori@unisa.it, May, Alexander2 (AUTHOR) alexander.may@iisb.fraunhofer.de, Rossi, Chiara2 (AUTHOR) chiara.rossi@iisb.fraunhofer.de, Rommel, Mathias2 (AUTHOR) mathias.rommel@iisb.fraunhofer.de, Rubino, Alfredo1 (AUTHOR) arubino@unisa.it, Licciardo, Gian Domenico1 (AUTHOR) gdlicciardo@unisa.it, Di Benedetto, Luigi1 (AUTHOR) ldibenedetto@unisa.it
Publikováno v:
Sensors (14248220). Dec2023, Vol. 23 Issue 24, p9653. 24p.
Autor:
Snoeij, M.F., Ivanov, M.V.
Publikováno v:
2011 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC); 2011, p248-250, 3p