Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Sjoerd Op 't Land"'
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2018, 60 (4), pp.965-970. ⟨10.1109/TEMC.2017.2756915⟩
IEEE Transactions on Electromagnetic Compatibility, 2018, 60 (4), pp.965-970. ⟨10.1109/TEMC.2017.2756915⟩
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2018, 60 (4), pp.965-970. ⟨10.1109/TEMC.2017.2756915⟩
IEEE Transactions on Electromagnetic Compatibility, 2018, 60 (4), pp.965-970. ⟨10.1109/TEMC.2017.2756915⟩
As the frequency of functional signals and interfering fields is rising beyond 1 GHz, the immunity of integrated circuits (ICs) against these higher frequencies is interesting. To design test setups that mimic the real-world interference an IC may re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e467189975d353ba529c958ecf8eb776
https://hal.archives-ouvertes.fr/hal-01698776/document
https://hal.archives-ouvertes.fr/hal-01698776/document
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2018, 60 (2), pp.298-309
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2018, 60 (2), pp.298-309. ⟨10.1109/temc.2017.2714760⟩
IEEE Transactions on Electromagnetic Compatibility, 2018, 60 (2), pp.298-309. ⟨10.1109/temc.2017.2714760⟩
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2018, 60 (2), pp.298-309
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2018, 60 (2), pp.298-309. ⟨10.1109/temc.2017.2714760⟩
IEEE Transactions on Electromagnetic Compatibility, 2018, 60 (2), pp.298-309. ⟨10.1109/temc.2017.2714760⟩
The design of cheaper and more compact electromagnetic compatibility (EMC) filters can be achieved by exploiting the magnetic coupling between components. This requires the knowledge of coupling coefficients between components and, consequently, of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::982b39e7baec50534126b5b938c5d945
https://hal.archives-ouvertes.fr/hal-01809981
https://hal.archives-ouvertes.fr/hal-01809981
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2014, 56 (4), pp.864-870. ⟨10.1109/TEMC.2014.2313231⟩
IEEE Transactions on Electromagnetic Compatibility, 2014, 56 (4), pp.864-870. ⟨10.1109/TEMC.2014.2313231⟩
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2014, 56 (4), pp.864-870. ⟨10.1109/TEMC.2014.2313231⟩
IEEE Transactions on Electromagnetic Compatibility, 2014, 56 (4), pp.864-870. ⟨10.1109/TEMC.2014.2313231⟩
International audience; Predicting the immunity of electronic boards to radiated electromagnetic interference requires the computation of the coupling efficiency of an electromagnetic field to PCB traces. In the case of complex PCBs, full-wave electr
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2017, 59 (6), pp.2042-2045. ⟨10.1109/TEMC.2017.2691800⟩
IEEE Transactions on Electromagnetic Compatibility, 2017, 59 (6), pp.2042-2045. ⟨10.1109/TEMC.2017.2691800⟩
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2017, 59 (6), pp.2042-2045. ⟨10.1109/TEMC.2017.2691800⟩
IEEE Transactions on Electromagnetic Compatibility, 2017, 59 (6), pp.2042-2045. ⟨10.1109/TEMC.2017.2691800⟩
International audience; When performing immunity measurements through the 10 × 10 cm aperture that some gigahertz transverse electromagnetic (GTEM) cells feature, its field uniformity is generally unknown. Yet, this (non)uniformity causes an error o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a32c5cb3c147afb547f8be83400ffdef
https://hal-univ-rennes1.archives-ouvertes.fr/hal-01622381/document
https://hal-univ-rennes1.archives-ouvertes.fr/hal-01622381/document
Publikováno v:
IEEE transactions on electromagnetic compatibility, 58(5), 1517-1525. IEEE
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2016, 58 (5), pp.1517-1525. 〈10.1109/TEMC.2016.2566449〉
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2016, 58 (5), pp.1517-1525. ⟨10.1109/TEMC.2016.2566449⟩
IEEE Transactions on Electromagnetic Compatibility, 2016, 58 (5), pp.1517-1525. ⟨10.1109/TEMC.2016.2566449⟩
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2016, 58 (5), pp.1517-1525. 〈10.1109/TEMC.2016.2566449〉
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2016, 58 (5), pp.1517-1525. ⟨10.1109/TEMC.2016.2566449⟩
IEEE Transactions on Electromagnetic Compatibility, 2016, 58 (5), pp.1517-1525. ⟨10.1109/TEMC.2016.2566449⟩
International audience; In modern electronic products, the printed circuit board (PCB) traces may well form the dominant coupling path in radiated immunity problems. Therefore, an understanding of the designable parameters that influence the worst-ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d8b73cc9cf57faebc172698e3f922298
https://research.utwente.nl/en/publications/210699d8-2484-4f04-9436-d5b28ace6acf
https://research.utwente.nl/en/publications/210699d8-2484-4f04-9436-d5b28ace6acf
Autor:
Frederic Lafon, Richard Perdriau, Marine Stojanovic, Sjoerd Op 't Land, Priscila Fernandez-Lopez
Publikováno v:
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), May 2016, SHENZHEN, China. pp.782-784, ⟨10.1109/APEMC.2016.7522865⟩
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), May 2016, SHENZHEN, China. pp.782-784, ⟨10.1109/APEMC.2016.7522865⟩
International audience; In filter design, inter-component parasitic couplings play a major role in the filter response. Most often, filter designers try to minimize these couplings through a proper implementation of components; conversely, this paper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e97433ae5a0a792db6a9c24469c335de
https://hal.archives-ouvertes.fr/hal-01400120
https://hal.archives-ouvertes.fr/hal-01400120
Publikováno v:
7th Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016
7th Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016, May 2016, Shenzhen, China. pp.207--210, ⟨10.1109/APEMC.2016.7523011⟩
7th Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016, May 2016, Shenzhen, China. Institute of Electrical and Electronics Engineers Inc., pp.207--210, 2016, 〈10.1109/APEMC.2016.7523011〉
7th Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016, May 2016, Shenzhen, China. pp.207--210, ⟨10.1109/APEMC.2016.7523011⟩
7th Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016, May 2016, Shenzhen, China. Institute of Electrical and Electronics Engineers Inc., pp.207--210, 2016, 〈10.1109/APEMC.2016.7523011〉
International audience; Predicting the immunity of printed circuit boards (PCBs) to radiated electromagnetic interference (EMI) requires the computation of the electromagnetic field's coupling to PCB traces. A modified Taylor-based analytical model e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::49e1e69c3edaa8be9be2d81adeecaec7
https://univ-rennes.hal.science/hal-01368134
https://univ-rennes.hal.science/hal-01368134
Autor:
M'Hamed Drissi, Richard Perdriau, Sjoerd Op 't Land, Mohamed Ramdani, Mohamed Amellall, Ali Ahaitouf
Publikováno v:
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015 10th International Workshop
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015 10th International Workshop, Nov 2015, EDINBURGH, United Kingdom. pp.24--28, ⟨10.1109/EMCCompo.2015.7358324⟩
EMC Compo
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2015 10th International Workshop, Nov 2015, EDINBURGH, United Kingdom. pp.24--28, ⟨10.1109/EMCCompo.2015.7358324⟩
EMC Compo
International audience; This paper deals with the conducted immunity of SPI EEPROM memories. The design and implementation of a wideband radio frequency-baseband multiplexer are described. This multiplexer makes it possible to superimpose radio frequ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::21f972c3e38faadae7b67aea881ea795
https://hal-univ-rennes1.archives-ouvertes.fr/hal-01380047
https://hal-univ-rennes1.archives-ouvertes.fr/hal-01380047
Autor:
Richard Perdriaus, Mohamed Ramdani, M'Hamed Drissi, Mohamed Amellal, Sjoerd Op 't Land, Ali Ahaitouf
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2015, 57 (3) (3), pp.603-606. ⟨10.1109/TEMC.2015.2405089⟩
IEEE Transactions on Electromagnetic Compatibility, 2015, 57 (3) (3), pp.603-606. ⟨10.1109/TEMC.2015.2405089⟩
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2015, 57 (3), pp.603-606. 〈10.1109/TEMC.2015.2405089〉
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2015, 57 (3) (3), pp.603-606. ⟨10.1109/TEMC.2015.2405089⟩
IEEE Transactions on Electromagnetic Compatibility, 2015, 57 (3) (3), pp.603-606. ⟨10.1109/TEMC.2015.2405089⟩
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2015, 57 (3), pp.603-606. 〈10.1109/TEMC.2015.2405089〉
This letter describes the design and implementation of a wideband radio frequency-baseband multiplexer. This device makes it possible to superimpose radio frequency noise to a functional baseband signal with controlled and repeatable transfer charact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8db54c6472e1cdad5274f17b896c8236
https://hal.archives-ouvertes.fr/hal-01161603
https://hal.archives-ouvertes.fr/hal-01161603
Publikováno v:
EMC Compo
Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2013), Proceedings of the 9th International Workshop on
Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2013), The 9th International Workshop on
Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2013), The 9th International Workshop on, Dec 2013, Nara, Japan. pp.1-6
Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2013), Proceedings of the 9th International Workshop on
Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2013), The 9th International Workshop on
Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2013), The 9th International Workshop on, Dec 2013, Nara, Japan. pp.1-6
International audience; Printed Circuit Board (PCB) traces play a role in the immunity of electronic products. Contrary to Integrated Circuits (ICs), the layout of PCB traces can be changed rather late in a product's design. Therefore, it is interest