Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Sivan Lachman-Shalem"'
Publikováno v:
Control Engineering Practice. 15:793-802
The manufacture of integrated circuits is driven by a demand for faster calculation capabilities and lower costs, which will require the development of a new generation of manufacturing tools to increase yield productivity, spearheaded by improved me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19eed5cf24ed344473ef6ccc4314640f
https://doi.org/10.1016/j.conengprac.2006.04.003
https://doi.org/10.1016/j.conengprac.2006.04.003
Publikováno v:
IFAC Proceedings Volumes. 38:321-326
The manufacture of integrated circuits is driven by a demand for faster calculation capabilities and lower costs, which will require the development of a new generation of manufacturing tools to increase yield productivity, spearheaded by improved me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1cea9583ea0d82d954900ae9bb0e46a
https://doi.org/10.3182/20050703-6-cz-1902.01629
https://doi.org/10.3182/20050703-6-cz-1902.01629
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 15:310-322
This paper describes a novel approach for the control of the entire photolithography track using a combination of two methods: genetic programming (GP) and nonlinear model predictive control (NMPC). Here, the GP-NMPC approach is used to derive a mult
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a97192fcc00197cdd15b3ceaf9defec
https://doi.org/10.1109/tsm.2002.801392
https://doi.org/10.1109/tsm.2002.801392
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 15:60-70
This paper describes the application of model-based principal component analysis (MBPCA) to the identification and isolation of faults in NMOS manufacture. In MBPCA, multivariate statistics are applied to the analysis of the portion of the data varia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96eb8dd31ad9c1c994541f8133b08a76
https://doi.org/10.1109/66.983445
https://doi.org/10.1109/66.983445
Publikováno v:
SPIE Proceedings.
This paper describes the application of model-based principal component analysis (MBPCA) to the identification and isolation of faults in CMOS manufacture. Some of the CMOS fabrication processing steps are well understood, with first principles mathe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e9e49062f74e881371efff459fe7938
https://doi.org/10.1117/12.410084
https://doi.org/10.1117/12.410084
Autor:
Sivan Lachman-Shalem, Eitan N. Shauly
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 22:592
In this study, boron diffusion and activation characteristics of samples implanted with F co-implantation were studied to meet the challenge of lower sheet resistance. Samples were implanted with F co-implantation in a dose range of 0 (no F) to 5×10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf2a7d7086d040b2770d0ba5a4f49929
https://doi.org/10.1116/1.1651548
https://doi.org/10.1116/1.1651548