Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Sivam, S.P. Sundar Singh"'
Autor:
Sivam, S.P. Sundar Singh, Babu Loganathan, Ganesh, Harshavardhana, N., Kumaran, D., Prasanna, P.
Publikováno v:
In Materials Today: Proceedings 2021 45 Part 2:1055-1062
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science (Sage Publications, Ltd.); Apr2024, Vol. 238 Issue 8, p3226-3234, 9p
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science (Sage Publications, Ltd.); Apr2024, Vol. 238 Issue 8, p3287-3298, 12p
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science (Sage Publications, Ltd.); Apr2024, Vol. 238 Issue 8, p3204-3214, 11p
Autor:
Pramanik, Sumit, Datta, Shubhabrata, Cheralathan, M., Sivam, S.P. Sundar Singh, Rajendran, R.
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science; April 2024, Vol. 238 Issue: 8 p3287-3298, 12p
Autor:
Pramanik, Sumit, Datta, Shubhabrata, Cheralathan, M., Sivam, S.P. Sundar Singh, Rajendran, R.
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science; April 2024, Vol. 238 Issue: 8 p3204-3214, 11p
Autor:
Pramanik, Sumit, Datta, Shubhabrata, Cheralathan, M., Sivam, S.P. Sundar Singh, Rajendran, R.
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science; April 2024, Vol. 238 Issue: 8 p3226-3234, 9p
Publikováno v:
International Journal of Manufacturing Research; 2022, Vol. 17 Issue: 3 p268-282, 15p
Autor:
Sivam, S.P. Sundar Singh, Loganathan, Ganesh Babu, Kumaran, D., Saravanan, K., Rajendra Kumar, S.
Publikováno v:
Materials Science Forum; August 2019, Vol. 969 Issue: 1 p876-881, 6p
Autor:
Sivam, S.P. Sundar Singh, Loganathan, Ganesh Babu, Kumaran, D., Saravanan, K., Rajendra Kumar, S.
Publikováno v:
Materials Science Forum; August 2019, Vol. 969 Issue: 1 p637-643, 7p