Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Siva Kolachina"'
Autor:
Charles P. Todd, Aswin N. Mehta, Omar Diaz de Leon, Daniel Gobled, Kendall S. Wills, James Grund, Rand B. Carawan, Sundari Nagarathnam, Willmar E. Subido, Kartik Ramanujachar, Siva Kolachina, Tim Nagel, Christine Charpentier
Publikováno v:
ISTFA 2001: Conference Proceedings from the 27th International Symposium for Testing and Failure Analysis.
Optical waveform probing is a critical component in flipchip diagnostics. There is a dramatic increase in the need for backside silicon probing of non-flipchip packaged devices. The effective way to implement this strategy is to package the die in a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35e6c473488776a7a1167044f3841ae8
https://doi.org/10.31399/asm.cp.istfa2001p0051
https://doi.org/10.31399/asm.cp.istfa2001p0051
Publikováno v:
International Symposium for Testing and Failure Analysis.
Thermally-Induced Voltage Alteration (TIVA) is a relatively new technique for locating electrical defects in integrated circuits [1,2]. This paper describes a novel application of TIVA, to locate design anomalies. A newly designed integrated circuit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d4ca850c71f4723a7bedb031fda61e9
https://doi.org/10.31399/asm.cp.istfa2000p0497
https://doi.org/10.31399/asm.cp.istfa2000p0497