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pro vyhledávání: '"Siti Rabiatul Aisya Idris"'
Publikováno v:
Soldering & Surface Mount Technology. 28:125-132
Purpose The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::479bbc80c61921b0360c9ac0e2028101
https://doi.org/10.1108/ssmt-08-2015-0022
https://doi.org/10.1108/ssmt-08-2015-0022
