Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Siti Farahnabilah MUHD AMLI"'
Autor:
Mohd Izrul Izwan RAMLI, Rita MOHD SAID, Flora SOMIDIN, Siti Farahnabilah MUHD AMLI, Siti Nor Atirah MUSTAPHA
Publikováno v:
European Journal of Materials Science and Engineering, Vol 8, Iss 2, Pp 69-73 (2023)
In this study, the effect of growth microstructure on diffusion and intermetallic compound of Sn-58Bi/SAC305 solder joint with different of SAC305 size and reflow temperature had been studied. For effect of different size, it used 180°C reflow tempe
Externí odkaz:
https://doaj.org/article/717cf962b6d3437b83827c282c088d54
Autor:
Mohd Izrul Izwan RAMLI, Siti Farahnabilah MUHD AMLI, Norainiza SAUD, Dewi Suriyani CHE HALIN, Nur Akrimi Maswa MD FAUZI
Publikováno v:
European Journal of Materials Science and Engineering, Vol 8, Iss 1, Pp 30-35 (2023)
Hot Air Solder Leveling (HASL) is one of the most commonly used surface finishes in the industry. HASL is also one of the least expensive types of PCB surface finishes available. This study aims to examine the influence on the solder joint microstruc
Externí odkaz:
https://doaj.org/article/0017359e96f3466486e84705c8bfc407
Autor:
Vizureanu, Siti Farahnabilah Muhd Amli, Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Hideyuki Yasuda, Kazuhiro Nogita, Mohd Mustafa Al Bakri Abdullah, Ovidiu Nemes, Andrei Victor Sandu, Petrica
Publikováno v:
Materials; Volume 16; Issue 12; Pages: 4360
The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=multidiscipl::1ef8cfe8373d361596119e034a78bfab
Autor:
Siti Farahnabilah Muhd Amli, Mohd Izrul Izwan Ramli, Nurul Razliana Abdul Razak, Mohd Arif Anuar Mohd Salleh
Publikováno v:
Sains Malaysiana. 49:3255-3259
The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb53397418494b15d878c15d1e897b02
https://doi.org/10.17576/jsm-2020-4912-36
https://doi.org/10.17576/jsm-2020-4912-36
Autor:
Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Nur Syahirah Mohamad Zaimi, Andrei Victor Sandu, Petrica Vizureanu, Adam Rylski, Siti Farahnabilah Muhd Amli
Publikováno v:
Materials (Basel, Switzerland). 15(4)
Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ffc6e8d3939723d90213a652913d1777
https://pubmed.ncbi.nlm.nih.gov/35207990
https://pubmed.ncbi.nlm.nih.gov/35207990
Autor:
Rita Mohd Said, Jitrin Chaiprapa, Siti Farahnabilah Muhd Amli, Petrica Vizureanu, Mohd Mustafa Al Bakri Abdullah, Andrei Victor Sandu, Mohd Arif Anuar Mohd Salleh, Norainiza Saud, Adam Rylski, Marcin Nabiałek, Mohd Izrul Izwan Ramli
Publikováno v:
Materials; Volume 14; Issue 18; Pages: 5134
Materials, Vol 14, Iss 5134, p 5134 (2021)
Materials
Materials, Vol 14, Iss 5134, p 5134 (2021)
Materials
This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::48ab0e045da7afa06901595aeb4de09b
https://doi.org/10.3390/ma14185134
https://doi.org/10.3390/ma14185134
Autor:
Rita Mohd Said, Juyana A. Wahab, Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Nurul Razliana Abdul Razak, Siti Farahnabilah Muhd Amli
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 701:012029
The effect of different surface finish with Sn-3.0Ag-0.5Cu (SAC305) solder was successfully investigated. The SAC305 solder was fabricated by using casting method and solder was placed on copper substrate that coated with different surface finish. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51bc2a7dc9fd6b1141c6cdd535e31794
https://doi.org/10.1088/1757-899x/701/1/012029
https://doi.org/10.1088/1757-899x/701/1/012029
Autor:
Siti Farahnabilah Muhd Amli, Mohd Izrul Izwan Ramli, Nurul Ashikin Saleh, Mohd Arif Anuar Mohd Salleh
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 701:012024
This study investigate the effect of Zn additions on wettability and thermal properties of Sn-0.7Cu-0.05Ni lead-free solder alloy. The additional of alloying element have been developed by using casting technique with different percentage of Zn which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::287c5d87d7ff239d0133d694e31fb7a1
https://doi.org/10.1088/1757-899x/701/1/012024
https://doi.org/10.1088/1757-899x/701/1/012024
Autor:
Amli, Siti Farahnabilah Muhd1,2 (AUTHOR) sitifarahnabilah@outlook.com, Salleh, Mohd Arif Anuar Mohd1,2 (AUTHOR) arifanuar@unimap.edu.my, Aziz, Mohd Sharizal Abdul3 (AUTHOR) msharizal@usm.my, Yasuda, Hideyuki4 (AUTHOR) yasuda.hideyuki.6s@kyoto-u.ac.jp, Nogita, Kazuhiro5 (AUTHOR) k.nogita@uq.edu.au, Abdullah, Mohd Mustafa Al Bakri1 (AUTHOR), Nemes, Ovidiu6 (AUTHOR) arifanuar@unimap.edu.my, Sandu, Andrei Victor7,8 (AUTHOR) sav@tuiasi.ro, Vizureanu, Petrica7,9 (AUTHOR) peviz@tuiasi.ro
Publikováno v:
Materials (1996-1944). Jun2023, Vol. 16 Issue 12, p4360. 17p.
Autor:
Ramli, Mohd Izrul Izwan1,2 (AUTHOR) izrulizwan@unimap.edu.my, Salleh, Mohd Arif Anuar Mohd1,2 (AUTHOR) arifanuar@unimap.edu.my, Sandu, Andrei Victor1,3,4,5 (AUTHOR) arifanuar@unimap.edu.my, Amli, Siti Farahnabilah Muhd1,2 (AUTHOR) norainiza@unimap.edu.my, Said, Rita Mohd1,2 (AUTHOR) mustafa_albakri@unimap.edu.my, Saud, Norainiza1,2 (AUTHOR) peviz@tuiasi.ro, Abdullah, Mohd Mustafa Al Bakri1,2 (AUTHOR), Vizureanu, Petrica1,3 (AUTHOR), Rylski, Adam6 (AUTHOR) adam.rylski@p.lodz.pl, Chaiprapa, Jitrin7 (AUTHOR) jitrin@slri.or.th, Nabialek, Marcin8 (AUTHOR) nmarcell@wp.pl
Publikováno v:
Materials (1996-1944). Sep2021, Vol. 14 Issue 18, p5134-5134. 1p.