Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish.

Autor: Ourdjini, A., Hanim, M.A.A., Koh, S.F.J., Siti Aisha, I., Tan, K.S., Chin, Y.T.

Publikováno v: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium; 2006, p437-442, 6p