Zobrazeno 1 - 2
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pro vyhledávání: '"Single Hsu"'
Autor:
Single Hsu, Brian Lee, Jansen Chee, Tamba Gbondo-Tugbawa, Ethan Wang, Ya-Chieh Lai, Eason Lin, Aaron Gower-Hall
Publikováno v:
Design-Process-Technology Co-optimization for Manufacturability XIV.
As we move to more advanced nodes, the number of Chemical Mechanical Polishing (CMP) steps in semiconductor processing is increasing rapidly. CMP is known to suffer from pattern dependent variation such as dishing, erosion, recess, etc., all of which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d21447ff09e2988bd3986fd3d34e4ad2
https://doi.org/10.1117/12.2551253
https://doi.org/10.1117/12.2551253
Publikováno v:
ECS Meeting Abstracts. :1470-1470
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6565d7fb5300a3a7085fc7aa6605a8b
https://doi.org/10.1149/ma2010-02/21/1470
https://doi.org/10.1149/ma2010-02/21/1470