Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Sinanis, M. D."'
Autor:
Back, D., Drummond, K. P., Sinanis, M. D., Weibel, J. A., Garimella, S V, Peroulis, D., Janes, D. B.
Publikováno v:
CTRC Research Publications
High-heat-flux removal is critical for the nextgeneration electronic devices to reliably operate within their temperature limits. A large portion of the thermal resistance in a traditional chip package is caused by thermal resistances at interfaces b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______540::60c6ba85d249179e7ef4425d9332b7d4
https://docs.lib.purdue.edu/coolingpubs/346
https://docs.lib.purdue.edu/coolingpubs/346
Autor:
Drummond, K. P., Back, D., Sinanis, M. D., Janes, D. B., Peroulis, D., Weibel, J. A., Garimella, S V.
Publikováno v:
CTRC Research Publications
High-heat-flux removal is necessary for next-generation microelectronic systems to operate more reliably and efficiently. Extremely high heat removal rates are achieved in this work using a hierarchical manifold microchannel heat sink array. The micr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______540::fd5f2d3e6e6e78e5ca042d27e699ae34
http://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1318&context=coolingpubs
http://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1318&context=coolingpubs
Autor:
Drummond, K. P., Back, D., Sinanis, M. D, Janes, D. B., Peroulis, D., Weibel, J. A., Garimella, S V
Publikováno v:
CTRC Research Publications
A hierarchical manifold microchannel heat sink array is fabricated and experimentally characterized for uniform heat flux dissipation over a footprint area of 5 mm x 5 mm. A 3 x 3 array of heat sinks is fabricated into the silicon substrate containin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______540::d79fa462ccfcc2ecae0afeec4938df08
https://docs.lib.purdue.edu/coolingpubs/327
https://docs.lib.purdue.edu/coolingpubs/327