Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Sinan Su"'
Autor:
Tayfun Gundogdu, Sinan Suli
Publikováno v:
CES Transactions on Electrical Machines and Systems, Vol 8, Iss 3, Pp 245-254 (2024)
The performance characteristics, particularly the starting performance of direct line-fed induction motors, which are mainly influenced by the design of the rotor, are crucial considerations for end-users. It is quite a challenging issue for motor ma
Externí odkaz:
https://doaj.org/article/b26f4e7864ba4233aad8887072ba0c74
Autor:
Diana Malaeb, Bassam Abdul Rasool Hassan, Ali Haider Mohammed, Sinan Subhi Farhan, Omar Abdulwahid Al-Ani, Abir Sarray El Dine, Feten Fekih-Romdhane, Sahar Obeid, Souheil Hallit
Publikováno v:
BMC Pediatrics, Vol 24, Iss 1, Pp 1-10 (2024)
Abstract Background Waterpipe tobacco smoking has increased tremendously at a global level among all age groups, particularly young people. Previous studies have examined the impact of waterpipe tobacco pictorial health warnings on adults but scarce
Externí odkaz:
https://doaj.org/article/0618b3aff5804e008d3ec8ef5519da49
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1473-1485
The reliability of an electronic assembly is typically limited by the failure of one of the solder interconnections. One of the key factors that define the quality of solder interconnections is the strength of the solder joint attachment to the print
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79f18111c0255d360c3cb3687b0a49a3
https://doi.org/10.1109/tcpmt.2019.2928267
https://doi.org/10.1109/tcpmt.2019.2928267
A multinational study on the factors influencing university students’ attitudes and usage of ChatGPT
Autor:
Maram Abdaljaleel, Muna Barakat, Mariam Alsanafi, Nesreen A. Salim, Husam Abazid, Diana Malaeb, Ali Haider Mohammed, Bassam Abdul Rasool Hassan, Abdulrasool M. Wayyes, Sinan Subhi Farhan, Sami El Khatib, Mohamad Rahal, Ali Sahban, Doaa H. Abdelaziz, Noha O. Mansour, Reem AlZayer, Roaa Khalil, Feten Fekih-Romdhane, Rabih Hallit, Souheil Hallit, Malik Sallam
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-14 (2024)
Abstract Artificial intelligence models, like ChatGPT, have the potential to revolutionize higher education when implemented properly. This study aimed to investigate the factors influencing university students’ attitudes and usage of ChatGPT in Ar
Externí odkaz:
https://doaj.org/article/b8055da1b8d846b787962a2a7972eab0
Autor:
Pradeep Lall, Cong Zhao, Haneen Ali, Sa'd Hamasha, Jeffrey C. Suhling, Mohammed Abueed, Francy John Akkara, Sinan Su, Arvind Sreenivasan
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
There has been a strong drive to remove Lead from electronics since the early 2000s. Solder alloys based on tin (Sn), copper (Cu) and silver (Ag) were regarded as promising candidates to replace the traditional SnPb solder. Later, it was found that o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1a1b93c2ea50bbafad35cd4ccfe0d9b
https://doi.org/10.1109/itherm45881.2020.9190943
https://doi.org/10.1109/itherm45881.2020.9190943
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Fatigue failure of interconnected solder joints is a critical consideration for the reliability of an electronic product. Commonly, fatigue properties of solder materials are investigated using large bulk samples. However, limited studies considered
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdce16518b40054c38ec10282503eb9a
https://doi.org/10.1109/itherm45881.2020.9190479
https://doi.org/10.1109/itherm45881.2020.9190479
Publikováno v:
Journal of Electronic Packaging. 143
The reliability of solder joints plays a critical role in electronic assemblies. SnAgCu solder alloys with doped elements such as Bi and Sb is one of the candidates for high reliability applications. However, the mechanical and fatigue properties of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fd8b71b3c7dc2d3030c9870ee950f34
https://doi.org/10.1115/1.4047341
https://doi.org/10.1115/1.4047341
Publikováno v:
2020 Pan Pacific Microelectronics Symposium (Pan Pacific).
In this paper, a direct comparison was conducted between SnPb and lead-free solder joints focused on long-term thermal cycling reliability after being exposed to high-temperature aging for a long period of time using two test vehicle designs. Ball Gr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::393f6b834dd698ad2119f283ccf18dbb
https://doi.org/10.23919/panpacific48324.2020.9059402
https://doi.org/10.23919/panpacific48324.2020.9059402
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1896-1904
Reliability of conventional electronic assemblies in real service applications is typically limited by fatigue failure of a single solder joint in reversed cyclic loading. Fatigue damage accumulation in a lead-free solder joint is still not well unde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79aed2feeb83bbc5301236a2ed6ff463
https://doi.org/10.1109/tcpmt.2018.2795347
https://doi.org/10.1109/tcpmt.2018.2795347
Autor:
Sa'd Hamasha, Francy John Akkara, Mohammad M. Hamasha, Atif Alkhazali, Sinan Su, Ravinder Thaper
Publikováno v:
Journal of Electronic Packaging. 141
Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods were used to model the fatigue
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0ec2031d20be8fd3f0cfc3d359fff45
https://doi.org/10.1115/1.4043405
https://doi.org/10.1115/1.4043405