Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Sina Yari-Karin"'
Autor:
Sepideh Safari, Mohsen Ansari, Heba Khdr, Pourya Gohari-Nazari, Sina Yari-Karin, Amir Yeganeh-Khaksar, Shaahin Hessabi, Alireza Ejlali, Jorg Henkel
Publikováno v:
IEEE Access, Vol 10, Pp 12229-12251 (2022)
The relentless technology scaling has provided a significant increase in processor performance, but on the other hand, it has led to adverse impacts on system reliability. In particular, technology scaling increases the processor susceptibility to ra
Externí odkaz:
https://doaj.org/article/9b18364c45984ec9a28de9e49b0e76b1
Publikováno v:
IEEE Transactions on Sustainable Computing. 8:82-93
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be354e30f7cfc370467f09aa4f546516
https://doi.org/10.1109/tsusc.2022.3186656
https://doi.org/10.1109/tsusc.2022.3186656
Autor:
Alireza Ejlali, Mohsen Ansari, Sina Yari-Karin, Jorg Henkel, Pourya Gohari-Nazari, Muhammad Shafique, Sepideh Safari, Heba Khdr
Publikováno v:
IEEE Transactions on Emerging Topics in Computing. 10:1883-1897
Low power consumption, real-time computing, and high reliability are three key requirements/design objectives of real-time embedded systems. The standby-sparing technique can improve system reliability while it might increase the temperature of the s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6aca351315fef3781fc2eda1c46f8dfb
https://doi.org/10.1109/tetc.2021.3120084
https://doi.org/10.1109/tetc.2021.3120084
Autor:
Pourya Gohari-Nazari, Amir Mahdi Hosseini Monazzah, Javad Saber-Latibari, Alireza Ejlali, Mohsen Ansari, Sina Yari-Karin
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 40:646-654
Tackling the dark silicon problem in a heterogeneous multicore system, the temperature constraints across the system should be addressed carefully by assigning a proper set of tasks to a pool of the heterogeneous cores during the run-time. When such
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e69bc418fee04207e1b2635cfa8f85b
https://doi.org/10.1109/tcad.2020.3003288
https://doi.org/10.1109/tcad.2020.3003288
Thermal Design Power (TDP) as the chip-level power constraint for a specific chip has been exploited in fault-tolerant embedded systems. TDP, as the chip-level power constraint of the system, could be either pessimistic or thermally unsafe. Employing
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3e043ba1e0fe65a6309ae6b85c39c7e1
https://doi.org/10.36227/techrxiv.14703192.v1
https://doi.org/10.36227/techrxiv.14703192.v1
