Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Sin Heng Lim"'
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 28:355-363
The reaction kinetics of microwave cure process of underfill materials in flip-chip packaging was investigated with nonisothermal kinetic method and compared with that of the thermal cure. Three-dimensional (3-D) nonlinear cure kinetic and transient
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::408ab8ad6cdd7cff5286a71b42d5dcda
https://doi.org/10.1109/tepm.2005.857676
https://doi.org/10.1109/tepm.2005.857676
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing; Oct2005, Vol. 28 Issue 4, p355-363, 9p