Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Simon Thomann"'
Publikováno v:
IEEE Open Journal of Circuits and Systems, Vol 4, Pp 258-270 (2023)
Cryogenic CMOS circuits that efficiently connect the classical domain with the quantum world are the cornerstone in bringing large-scale quantum processors to reality. The major challenges are, however, the tight power budget (in the order of milliwa
Externí odkaz:
https://doaj.org/article/9a6739c9800246a697415b2bb458463b
Publikováno v:
Frontiers in Electronics, Vol 3 (2022)
The separation of computing units and memory in the computer architecture mandates energy-intensive data transfers creating the von Neumann bottleneck. This bottleneck is exposed at the application level by the steady growth of IoT and data-centric d
Externí odkaz:
https://doaj.org/article/89e220fd2f2147819613826df890332d
Autor:
Brunno Alves de Abreu, Albi Mema, Simon Thomann, Guilherme Paim, Paulo Flores, Sergio Bampi, Hussam Amrouch
Publikováno v:
IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 13:86-95
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. :1-10
Publikováno v:
IEEE Transactions on Electron Devices. 69:5316-5323
We have developed a comprehensive modeling framework to explain the switching characteristics of BEOL-compatible FeFET with an amorphous IGZO channel. Our TCAD-based modeling framework, calibrated against measurement data, jointly incorporates a) the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::934181578d3fd90fcfa43d2ca43fd9f8
https://doi.org/10.36227/techrxiv.22692940
https://doi.org/10.36227/techrxiv.22692940
Autor:
Mikail Yayla, Simon Thomann, Sebastian Buschjager, Katharina Morik, Jian-Jia Chen, Hussam Amrouch
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. 69:2516-2528
Publikováno v:
2023 IEEE International Reliability Physics Symposium (IRPS).
Autor:
Shan Deng, Mahdi Benkhelifa, Simon Thomann, Zubair Faris, Zijian Zhao, Tzu-Jung Huang, Yixin Xu, Vijaykrishnan Narayanan, Kai Ni, Hussam Amrouch
Publikováno v:
2022 International Electron Devices Meeting (IEDM).
Publikováno v:
2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS).