Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Simon Maus"'
Publikováno v:
Light-Emitting Devices, Materials, and Applications XXIV.
Packaging materials usable for DUV-LEDs are limited as most organic materials are affected by DUV radiation. Packages used are TO-packages or 3D-structured ceramic housings with quartz lid. Due to DUV-LEDs radiating up to 50% of their light to the si
Autor:
Oliver Gyenge, Ha-Duong Ngo, Piotr Mackowiak, Simon Maus, Bei Wang, Manuel Baeuscher, Yucheng Zhang, Oswin Ehrmann, Klaus-Dieter Lang, Ulli Hansen, Xiaodong Hu
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Anodic bonding technology is a well-established industrial technique, which is reported to be the most widely used MEMS packaging method. This Paper studies residual stress issue caused by different coefficients of thermal expansion (CTE) between sil
Autor:
Martin Schneider-Ramelow, Simon Maus, Ha-Duong Ngo, Oswin Ehrmann, Piotr Mackowiak, Ulli Hansen, Yucheng Zhang, Klaus-Dieter Lang, Xiaodong Hu, Maozhou Meng, Oliver Gyenge
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
In the present work, an intermediate sodium-rich glass layer was deposited on silicon wafer by a PVD (Physical Vapor Deposition) process for further silicon to silicon anodic bonding. The anodic bonding process was carried out at low direct-current v
Autor:
Ha-Duong Ngo, Oswin Ehrmann, Ulli Hansen, Oliver Gyenge, Piotr Mackowiak, N. Vokmer, Xiaodong Hu, Klaus Dieter Lang, Maozhou Meng, Simon Maus, Manuel Baeuscher, Biswajit Mukhopadhyay
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
The anodic bonding technology is a well-established industrial technique, which has been reported to account for the mainstream packaging methods in Micro-Electro-Mechanical-Systems (MEMS) devices, such as hermetic sealing, encapsulation, and wafer l
Autor:
Manuel Bauscher, Martin Ihle, Piotr Mackowiak, Ha-Duong Ngo, Klaus-Dieter Lang, Ulli Hansen, Biswajit Mukhopadhyay, Xiaodong Hu, Steffen Ziesche, Yucheng Zhang, Oliver Gyenge, Hans Walter, Simon Maus, Oswin Ehrmann, Ole Hoelck
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to L
Publikováno v:
Procedia Chemistry. 1(1):76-79
The use of a plasma-assisted e-beam evaporation process enables a cost-efficient exploitation of the outstanding material properties of borosilicate glass – a chemically very inert material with minimal moisture absorption, excellent optical proper
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
A batch compatible glass deposition process is presented, that enables the use of molded packages for optical sensors even in the field of high quality devices. The deposition technology discussed allows to form compact and dense borosilicate glass l
Autor:
Karin Hauck, Simon Maus, Juergen Leib, Ivan Ndip, Michael Toepper, Oliver Gyenge, Ulli Hansen
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
A novel approach on wafer-level passivation of power devices using a thin, hermetic borosilicate glass layer as passivation or dielectric layer is presented here. The technology will be benchmarked to those conventional technologies. The glass layer
Autor:
Simon Maus, Juergen Leib, Kai Zoschke, Karin Hauck, Oliver Gyenge, Ulli Hansen, Michael Toepper
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
A novel process flow to manufacture miniaturized optical windows on wafer-level is presented. Those windows can be used for miniaturized optical products like high-brightness LEDs (HB-LED) and digital projection (DLP) as well as more complex optical
Autor:
Karin Hauck, Michael Toepper, Juergen Leib, Holger Feindt, Ulli Hansen, Kai Zoschke, Simon Maus
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
The use of borosilicate glass for anodic wafer bonding to silicon is well established in industry. In this paper we present a matured approach, where a microstructured borosilicate glass thin-film instead of a bulk glass wafer is used as anodic bond