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Elimination of splash damage for smaller scribe widths in next-gen memory devices via stealth dicing
Autor:
Lim, Dao Kun, Vempaty, Venkata Rama Satya Pradeep, Yu, Aibin, Sim, Wen How, Singh, Harjashan Veer
Publikováno v:
In Materials Science in Semiconductor Processing October 2024 181
Autor:
Lim, Dao Kun, Vempaty, Venkata Rama Satya Pradeep, Shah, Ankur Harish, Sim, Wen How, Singh, Harjashan Veer
Publikováno v:
Components, Packaging, and Manufacturing Technology, IEEE Transactions on; September 2023, Vol. 13 Issue: 9 p1486-1493, 8p