Zobrazeno 1 - 10
of 76
pro vyhledávání: '"Sijun Du"'
Autor:
Shuang Song, Dehong Wang, Mengyu Li, Siyao Cao, Feijun Zheng, Kai Huang, Zhichao Tan, Sijun Du, Menglian Zhao
Publikováno v:
IEEE Open Journal of Circuits and Systems, Vol 5, Pp 267-290 (2024)
Multiple parameter environment monitoring via wireless Internet of Thing sensors is growing rapidly, thanks to low power techniques of the node. More importantly, the ever more complex and highly efficient energy harvesting systems enable long-term c
Externí odkaz:
https://doaj.org/article/79030e26e272488390018616b9ada1c9
Publikováno v:
Energy Reports, Vol 8, Iss , Pp 783-791 (2022)
Short-term load forecasting (STLF) is the basis of the power system operation. Considering that the importance of different training samples is different, a sample weights assignment method is proposed in this paper to help the STLF to learn the key
Externí odkaz:
https://doaj.org/article/6bac57f034b740ddb9cc4e98dc433ac4
Publikováno v:
Energies, Vol 13, Iss 11, p 2720 (2020)
With the advancing trend towards lighter and faster rail transport, there is an increasing interest in integrating composite and advanced multifunctional materials in order to infuse smart sensing and monitoring, energy harvesting and wireless capabi
Externí odkaz:
https://doaj.org/article/6129bc6e631744198c90f05de047a093
Publikováno v:
IEEE Transactions on Power Electronics. 38:9195-9205
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c442dd9b491cb625b63ad5d3b0b94ef2
https://doi.org/10.1109/tpel.2023.3262728
https://doi.org/10.1109/tpel.2023.3262728
Publikováno v:
IEEE Transactions on Power Electronics. 38:5032-5040
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::033694a1049fdac703e8b0090a4ab567
https://doi.org/10.1109/tpel.2023.3235305
https://doi.org/10.1109/tpel.2023.3235305
Autor:
Xinling Yue, Sijun Du
Publikováno v:
IEEE Transactions on Circuits and Systems II: Express Briefs. 70:1560-1564
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e2ad6bb39a30c6d8d6862af16cb1835
https://doi.org/10.1109/tcsii.2022.3224033
https://doi.org/10.1109/tcsii.2022.3224033
Publikováno v:
IEEE Transactions on Circuits and Systems II: Express Briefs. 70:1014-1018
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1101116eaa80020c0d34fd1d35ea0b96
https://doi.org/10.1109/tcsii.2022.3219243
https://doi.org/10.1109/tcsii.2022.3219243
Autor:
Wenyu Peng, Sijun Du
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers. :1-14
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2023901b0d475bcad6b15f8d1b12a289
https://doi.org/10.1109/tcsi.2023.3261780
https://doi.org/10.1109/tcsi.2023.3261780
Publikováno v:
IEEE Solid-State Circuits Letters. 6:29-32
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0873594213b9d41bfc50a280855d278e
https://doi.org/10.1109/lssc.2023.3239691
https://doi.org/10.1109/lssc.2023.3239691
Autor:
Xinling Yue, Sijun Du
Publikováno v:
IEEE Journal of Solid-State Circuits. :1-10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b2fb7ecd61d7a4a21055f1e84f93f95
https://doi.org/10.1109/jssc.2023.3260145
https://doi.org/10.1109/jssc.2023.3260145