Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Siebe Bouwstra"'
Autor:
Slava Krylov, Miriam Hershcovitz, David Mendlovic, Siebe Bouwstra, Eli Ashkenazy, Peleg Levin, Ariel Raz
Publikováno v:
Journal of Microelectromechanical Systems. 29:357-369
We report on the design, fabrication and characterization of a wafer level packaged, vacuum sealed, fully integrated and cell-phone compatible tunable micromachined Fabry-Perot filter ( $\mu $ FPF), operating within the visual and near-infrared (VIS-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24aa4edfad1fbb557af1548180ebe61b
https://doi.org/10.1109/jmems.2020.2975568
https://doi.org/10.1109/jmems.2020.2975568
A Wafer Level Packaged Fully Integrated Hyperspectral Fabry-Perot Filter with Extended Optical Range
Autor:
Ariel Raz, Siebe Bouwstra, Miriam Hershcovitz, Slava Krylov, Peleg Levin, Eli Ashkenazy, David Mendlovic
Publikováno v:
2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS).
We report on the first demonstration of a wafer level packaged, vacuum sealed, fully integrated and cell-phone compatible tunable micromachined Fabry-Perot filter $(\mu \mathrm{FPF})$ , operating within the visual and near-infrared (VIS-NIR) optical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cad7f7db112bc7ac477b2394db29d7a7
https://doi.org/10.1109/memsys.2019.8870831
https://doi.org/10.1109/memsys.2019.8870831
Publikováno v:
Sensors and Actuators A: Physical. 92:242-248
The magnetic properties of pulse reverse (PR) electroplated CoNiFe and DC electroplated NiFe are presented. CoNiFe is a very promising material for magnetic microsystems due to the possibility of achieving a high saturation flux density (Bs) and a lo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a21d8d94ddabc8dd9bfaa1fc8263114a
https://doi.org/10.1016/s0924-4247(01)00556-8
https://doi.org/10.1016/s0924-4247(01)00556-8
Publikováno v:
Technical University of Denmark Orbit
We present an atomic force microscopy (AFM) probe with integrated piezoresistive read-out. The probe consists of a micromachined cantilever with a tip at the end. The cantilever is a multilayer structure with its thickness defined by etch-stop and th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::67ad0e45153d36a003b131faa6edd45b
https://doi.org/10.1016/s0924-4247(01)00545-3
https://doi.org/10.1016/s0924-4247(01)00545-3
Autor:
Matthias Heschel, Jens Anders Branebjerg, Pirmin Hermann Otto Rombach, A. Hoogerwerf, K. Rasmussen, Siebe Bouwstra, M. Amskov Gravad, Jakob Janting, U. Klein, Matthias Müllenborn, Jochen Friedrich Kuhmann
Publikováno v:
Sensors and Actuators A: Physical. 92:23-29
The first results of silicon microphones that are completely batch-packaged and integrated with signal conditioning circuitry in a chip stack are discussed. The chip stack is designed to be directly mounted into a system, such as a hearing instrument
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::803a7fc3a15ac73f289cddbfd5c4b0dc
https://doi.org/10.1016/s0924-4247(01)00535-0
https://doi.org/10.1016/s0924-4247(01)00535-0
Publikováno v:
Sensors Update. 9:21-68
This chapter reports on the design and manufacturing of multiple through-wafer interconnects for stacking of microelectromechanical devices. The feedthroughs have been applied to an interconnect (intermediate) layer for an integrated microphone. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58983def11d791276d53c9b166a2dd94
https://doi.org/10.1002/1616-8984(200105)9:1<21::aid-seup21>3.0.co
https://doi.org/10.1002/1616-8984(200105)9:1<21::aid-seup21>3.0.co
Publikováno v:
ResearcherID
A novel design of micromachined capacitive microphone with inherently considerably higher sensitivity than traditional designs is presented in this paper. A process sequence is suggested and means to protect the structure against contamination with d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c999d43084dc5fbbd7f355cc8c9eaa36
https://doi.org/10.1088/0960-1317/9/1/003
https://doi.org/10.1088/0960-1317/9/1/003
Autor:
Pater Gravesen, Gert Friis Eriksen, Steen Weichel, Karsten Dyrbye, Roger de Reus, T. Romedahl Brown, Jakob Janting, O. Søndergaard Jensen, Jens Peter Krog, Carsten Christensen, Siebe Bouwstra
Publikováno v:
Microelectronics Reliability. 38:1251-1260
Packaging concepts for silicon-based micromachined sensors exposed to harsh environments are explored. By exposing the sensors directly to the media and applying protection at the wafer level the packaging and assembly will be simplified as compared
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96b2b406a30b1823e0ff696c9f63464e
https://doi.org/10.1016/s0026-2714(98)00149-8
https://doi.org/10.1016/s0026-2714(98)00149-8
Publikováno v:
Sensors and Actuators A: Physical. 52:25-32
In this paper we present an opto-mechanical sensor based on a Bragg grating as the strain-sensing element. The motivation for choosing this alternative way of strain sensing is that the sensed information is directly encoded into a wavelength, which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::802d4fb34c02750f7b6142c106a05768
https://doi.org/10.1016/0924-4247(96)80121-x
https://doi.org/10.1016/0924-4247(96)80121-x
Publikováno v:
Sensors and Actuators A: Physical. 52:121-125
The application of laser direct etching of silicon in developing and processing devices for microelectromechanical systems is discussed. The direct write system presented in this paper features high writing speed, high resolution and large access ran
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59e4aff3ffb88df2cf2c7eb2f2dce7b7
https://doi.org/10.1016/0924-4247(96)80136-1
https://doi.org/10.1016/0924-4247(96)80136-1