Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Sidsky VV"'
Autor:
Semchenko AV; Faculty of Physics and Information Technology, Francisk Skorina Gomel State University, 246019 Gomel, Belarus., Sidsky VV; Faculty of Physics and Information Technology, Francisk Skorina Gomel State University, 246019 Gomel, Belarus., Bdikin I; TEMA, Department of Mechanical Engineering, University of Aveiro, 3810-193 Aveiro, Portugal., Gaishun VE; Faculty of Physics and Information Technology, Francisk Skorina Gomel State University, 246019 Gomel, Belarus., Kopyl S; Department of Physics, CICECO-Aveiro Institute of Materials, University of Aveiro, 3810-193 Aveiro, Portugal., Kovalenko DL; Faculty of Physics and Information Technology, Francisk Skorina Gomel State University, 246019 Gomel, Belarus., Pakhomov O; Laboratory for 'Electro-and Magnetocaloric Materials and Structures', ITMO University, 197101 St. Petersburg, Russia., Khakhomov SA; Faculty of Physics and Information Technology, Francisk Skorina Gomel State University, 246019 Gomel, Belarus., Kholkin AL; Department of Physics, CICECO-Aveiro Institute of Materials, University of Aveiro, 3810-193 Aveiro, Portugal.
Publikováno v:
Materials (Basel, Switzerland) [Materials (Basel)] 2021 Mar 30; Vol. 14 (7). Date of Electronic Publication: 2021 Mar 30.
Autor:
Morozovska, A. N., Fesenko, O. M., Yaremkevich, A. D., Tsebrienko, T. V., Budnyk, O. P., Wang, Lei, Semchenko, A. V., Sidski, V. V.
Publikováno v:
Applied Nanoscience; Nov2023, Vol. 13 Issue 11, p7171-7185, 15p
Autor:
Sun, Guiyun, Li, Huan, Zhong, Siqi, Chen, Chen, Ren, Keju, Zeng, Zhixin, Deng, Xiaoling, Gao, Rongli, Cai, Wei, Fu, Chunlin, Chen, Gang, Wang, Zhenhua, Lei, Xiang
Publikováno v:
Journal of Materials Science: Materials in Electronics; Oct2023, Vol. 34 Issue 30, p1-16, 16p
Publikováno v:
Journal of Sol-Gel Science & Technology; Feb2023, Vol. 105 Issue 2, p489-499, 11p
Autor:
Afqir, Mohamed, Elaatmani, Mohamed, Zegzouti, Abdelouahad, Oufakir, Abdelhamid, Daoud, Mohamed
Publikováno v:
Journal of Materials Science: Materials in Electronics; Mar2019, Vol. 30 Issue 6, p5495-5502, 8p